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International Microelectronics And Packaging Society (IMAPS) Device Packaging 2018
March 6, 2018 @ 9:00 am – March 8, 2018 @ 5:00 pm
The 14th Annual Device Packaging Conference (DPC 2017) will be held in Fountain Hills, Arizona, on March 5-8, 2018. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.
- 3D IC & Packaging
- Wafer Level Packaging
- Engineered Micro Systems
- And more…
Steve Groothuis CTO of Samtec Microelectronics, will be presenting the following keynote presentation:
The Needs and Challenges Facing All Aspects of Medical Applications & Packaging
When faced with medical device and component needs and challenges, most packaging engineers thrive in defining innovations, workarounds, and solutions addressing those needs and challenges. However, advanced biomedical devices require extensive interdisciplinary development efforts from technologists and medical professionals as well as extensive testing and certification. Various new, exciting, and novel applications of MEMS & sensor technologies are central to the medical industry, from improving & innovating large medical equipment and portable medical instrumentation to enabling medical wearables and point of care devices. Areas of medical device packaging technology development and pathfinding need to include: heterogeneous device technologies, biocompatible materials, elimination of cytotoxicity, miniaturization schemes, robust interconnects (at device, package, module, & system levels), and the incorporation of microfluidics and optics. This presentation will focus on specific needs and challenges within upcoming medical applications and medical device packaging.
Samtec will be attending iMAPS Device Packaging from March 6-8 and featuring our Microelectronics packaging and IC solutions. For additional information and registration, please visit their official website.