The growth of system-on-modules (SOMs) in embedded computing presents a paradigm shift in embedded design. Legacy electronics systems typically leveraged discrete chip-down designs. The circuit designer was responsible for the selecting, designing and routing of the CPU, Memory, I/O, power and analog circuitry within their application. EEs continuously met the technical challenges presented before them. As Moore's Law moves along, system-level electronic design using the discrete … [Read more...]
Samtec Expands ExaMAX® High-Speed Backplane Connector System With New DMO Options
Networking switches and hubs in next-generation hyperscale data centers must support increased port density and higher data rates. In combination with increased processing power, system designers are leveraging the inherent advantages of direct mate orthogonal architectures when compared with traditional backplane systems. Samtec supports orthogonal backplane architectures with new DMO options from within the ExaMAX® High-Speed Backplane Connector System. Samtec ExaMAX® DMO … [Read more...]
Xilinx Features FireFly on VCU118 FPGA Dev Kit
You can do a lot in three minutes. From counting to 180 to making toast, the possibilities are endless. However, our good friend Steve Leibson at Xilinx, encourages you to use your three minutes to take a look at our new video featuring Samtec's FQSFP cable on Xilinx VCU118 FPGA. We couldn't agree more. 28Gbps FireFly Loopback in Action Steve goes on to state in his blog: "Samtec recently posted a 3-minute video demonstrating its FireFly Micro Flyover Cable … [Read more...]
QSFP-DD MSA Releases Latest Hardware Specification
The battle for next-generation optical transceivers remains active. The three leading specifications duking it out include COBO, OSFP and QSFP-DD. While all have their pros and cons, the industry continues to sort out the best solutions for the front panel and mid-board optical engines. What is QSFP-DD? Current QSFP solutions meet the existing demands of the telecom/datacom industries. The QSFP-DD MSA focuses on a next generation high-density, high-speed pluggable backwards … [Read more...]
A Vehicle For Insitu Glass Fabric Characterization (EDI CON 2017) – Glass Weave Skew
Glass Weave Skew. For most people it probably sounds like a progressive rock band. But we're talking about Glass Weave Skew and differential signals. Brandon Gore, Senior Staff Signal Integrity Engineer, and the Manager of Samtec's Signal Integrity Group, R&D Hub recently presented "A Vehicle For Insitu Glass Fabric Characterization" at EDI CON USA 2017. The research was completed by Brandon and supported by Scott McMorrow, Samtec’s CTO of Signal Integrity Products. In his … [Read more...]
Samtec Releases New Product Overview Guide
Who doesn’t like something new? Maybe it’s that new smell, a new flavor, or a new feature that draws you in each and every time. Well, we love new things around here and are excited to share the new Product Overview Guide. It might not smell or taste new, but it is packed with new technologies and our entire product line that supports full system signal integrity from Silicon-to-Silicon. New, standard and custom products are categorized in six solution blocks designed to support any … [Read more...]
Microelectronics Group Provides Support For Advanced Microelectronics Applications
The Samtec Microelectronics Group's (SME) advanced packaging and high-speed interconnect expertise enable us to provide support for the performance, integration and miniaturization demands of next gen applications, including Connectivity, MedTech, MEMS & Sensors, and Optics, Imaging & Photonics. Our advanced package design and glass core technology capabilities, along with standard design guidelines, are detailed in the new Microelectronics Interconnect Solutions … [Read more...]
Samtec Enhances Direct Connect™ Cable Systems With New DCH Series
Samtec recently expanded its Direct Connect™ Cable (DCC) Systems with the release of the new Direct Connect™ Horizontal (DCH) High-Speed Press-Fit Twinax Cable Assembly. This new solution targets cost-effective, high-performance flyover or co-planar, right angle and parallel board-to-board applications. Simplifies Assembly, Ideal for High Density Samtec DCH series features a high-retention, press-fit termination offering a direct connection to the PCB. The connectorless design eliminates … [Read more...]
How Total Solar Eclipses and FPGAs Align – SYZYGY
"Eclipse fever" gripped most of the United States this past Monday. Vast swathes of the country from the Pacific Northwest to the Southeast were mesmerized by a once-in-a-lifetime total solar eclipse. All walks of life stopped to watch the celestial phenomena. Viewing parties were held in cities and national parks. Astronomers had their fifteen seconds of fame. The general public learned new terms like "totality" and "syzygy". SYZYGY - A New FPGA Expansion Specification No doubt … [Read more...]
Flyover Enables High Speed, Simplifies PCB Design
Bob Hult, our friend at Bishop and Associates and Connector Supplier, recently published High Speed Signals Take The High Road on the Connector Supplier website. Among other things, the article discusses the challenges of high-speed signals in printed circuit boards. As always, Bob's article is well-researched and worth the read. But if you only have time for the Cliff's Notes, I'll try to summarize it here. Quick Summary Bob begins by pointing out that "as data rates pushed … [Read more...]
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