Regular readers of the Samtec blog are keenly aware of VITA 57 FMC and FMC+ solutions Samtec offers. For more than 10 years, this standard has defined the interface between FPGAs and various expansion modules in a growing number of applications. As FMC/FMC+ leverages open platforms and standards, developers are working to further the adaptation of FPGA technologies in applications ranging from datacom/telecom and broadcast video to instrumentation, aerospace and defense. More and more … [Read more...]
Samtec + Credo 112 Gbps PAM4 Long Reach Cable Demonstration
Credo and Samtec teamed-up to to show an impressive 112 Gbps PAM4 long-reach cable demonstration at DesignCon 2018. In this video, Samtec's Ralph Page and Credo's Alex Narazi walk us through the demo and the results achieved. Signal Path Three ports of 112 Gbps PAM4 data are sources from the Credo 112 Gbps PAM4 CDRs. The signals are routed through RF jumpers to an SI characterization card for Samtec's next-gen AcceleRatee® Cable Assemblies. One data path is a signal while the … [Read more...]
DesignCon 2018 Parting Thoughts – How real is 112 Gbps PAM4?
DesignCon 2018 has passed. For those involved from the high-speed communications and semiconductor communities, everyone needs time to catch their breath a bit before planning for the rest of 2018. Why? DesignCon always offers exposure to the latest state-of-the-art design methodologies, applications, technologies, and unparalleled networking opportunities. One question was on the minds of many: How real is 112 Gbps PAM4? The number of demos and presentation at DesignCon prove the … [Read more...]
Samtec Releases New High-Speed Cable Interconnect Solutions Guide
The phrase “high-speed cable assembly” can include a variety of products, which is exactly what you’ll find in Samtec’s new High-Speed Cable Interconnect Solutions Guide. But it’s more than products, Samtec combines high-speed cable assemblies with unmatched service and support to provide solutions for any specific application. This guide will walk you through the foundational pieces of Samtec’s high-speed cable offering – from copper and optics to RF and I/O assemblies – and industry-leading … [Read more...]
TI and Samtec Demo 56 Gbps PAM4 over Backplane at DesignCon 2018
Next-gen speeds were all the buzz at DesignCon this week at the Santa Clara Convention Center in Silicon Valley. Vendors from across the industry were showcasing their latest solutions: semiconductors, connectors, test and measurement, EDA, etc. One popular solution was backplane connectors and applications. Faster speeds and new backplane system architectures were front-and-center in many of the DesignCon booths. TI/Samtec 56Gbps PAM4 Backplane Demo TI and Samtec partnered on a … [Read more...]
56 Gbps PAM4 Product Demonstrations At DesignCon 2018
56 Gbps PAM4, 112 Gbps PAM4, and 28 Gbps DesignCon is where Samtec showcases new products and product demonstrations that display high-speed technologies for Silicon-to-Silicon optimization. Our demos this year show interconnect systems in 56 Gbps PAM4, 112 Gbps PAM4, and 28 Gbps applications. Here's a list of the demos scheduled for DesignCon 2018: 56 Gbps PAM4 Demonstration Of Keysight PXIe VNA and Samtec Flyover™ A Keysight M937XA PXIe VNA sources 16 pairs of 56G-PAM4 data … [Read more...]
Samtec New Products At DesignCon 2018
Samtec will be introducing several new products at DesignCon 2018. All of these products are designed to increase data rates, increase system density, and shrink product footprints, so designers can meet their system signal integrity needs. NovaRay™ High Bandwidth, High Density Array Samtec’s NovaRay™ is an industry-leading high bandwidth, high-density interconnect system. The pin-to-ground differential pair configuration enables very low crosstalk to 40 GHz+, tight impedance … [Read more...]
Samtec’s DesignCon 2018 Conference Schedule
DesignCon 2018, which is a big deal for Samtec, is a few weeks away. Our high-speed technologies for Silicon-to-Silicon optimization will be on full display and our product experts will show new products that are just released, or will be released in 2018. Our application engineers will demonstrate new system-level solutions, and our SI experts will present technical papers. In the next few weeks we'll write about all of these products, demos, events, and presentations. To help you … [Read more...]
VITA 57 Solutions Enable Scalable ASIC Development Platforms
Readers of the Samtec blog know that FPGAs offer the most flexible electronics development platform in the world. Diverse applications ranging from machine learning and embedded vision to 5G wireless and cloud computing leverage the configurability and programmability of FPGAs to scale I/O, computing and DSP functionality. FPGAs are also frequently used in next-generation ASIC development projects. FPGAs allow for fast and accurate ASIC modeling and verification with accelerated … [Read more...]
High Speed Backplane Optimized For 56 G, PAM4
Samtec is expanding its line of ExaMAX® high speed backplane connectors. The new system is a direct mate orthogonal (DMO) configuration. These products were recently on display at SC17 in Denver. In the video above, Jonathan Sprigler, Samtec's Backplane Product Manager, tells us about the products, their applications, and how they are optimized for speeds up to 56 Gbps, using PAM-4 modulation. DMO Architecture Improves Electrical Performance ExaMAX DMO solutions give system designers … [Read more...]
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