The growth of system-on-modules (SOMs) in embedded computing presents a paradigm shift in embedded design. Legacy electronics systems typically leveraged discrete chip-down designs. The circuit designer was responsible for the selecting, designing and routing of the CPU, Memory, I/O, power and analog circuitry within their application. EEs continuously met the technical challenges presented before them.
As Moore’s Law moves along, system-level electronic design using the discrete chip-down approach has increased in complexity. Simple MCUs have morphed into advanced ASICs. Next-gen DDR4 memory interfaces designs are detailed and nuanced. Multiple I/O protocols need supporting and the design cycle keeps shrinking.
Electronics systems designers readily use SOMs to simplify the design process and quicken time to market. SOMs are available industry-standard form factors while supporting the most-advanced ICs on the market. One SOM taking the market by storm is the NVIDIA® Jetson™ platform. The solution includes multiple SOMs and various development kits targeted for intelligent embedded design.
NVIDIA Jetson TX2 Module
The NVIDIA Jetson TX2 Module is the fastest, most power-efficient embedded AI SOM. The latest addition to the industry-leading Jetson embedded platform, this 7.5-watt SOM brings true AI computing at the edge.
It’s powered by NVIDIA Pascal™ architecture and loaded with 8 GB of memory and 59.7 GB/s of memory bandwidth. It features a variety of standard hardware interfaces for easy integration into intelligent edge devices like robots, drones, smart cameras, and portable medical devices.
NVIDIA Jetson TX1 Module
The NVIDIA Jetson TX1 Module features NVIDIA Maxwell™ architecture, 256 NVIDIA CUDA® cores, 64-bit CPUs, and a power-efficient design. It also includes the latest technology for deep learning, computer vision, GPU computing, and graphics applications.
Samtec SEARAY™ High-Density Open Pin Field Arrays
The Jetson TX1 and Jetson TX2 both contain a high-density connector on the back of the SOM for mating to development kits or application-specific carrier cards. Both platforms leverage an 8×50 SEARAY Terminal (SEAF series) that mates with an 8×50 SEARAY Socket (SEAM series) found on the carrier card.
Samtec’s SEARAY High-Speed High-Density Open Pin Field Arrays offer many features that give system designers a preferred option for high-speed mezzanine applications. SEARAYs design flexibility, low insertion/extraction force, rugged features and high-speed are the perfect combination the for NVIDIA Jetson platforms.
SEARAY is on a 1.27 mm X 1.27 mm grid. The open pin field design gives designers the ability to simultaneously run differential pairs, single-ended signals and power (up to 1.8/pin) through the same interconnect. This provides maximum grounding and routing flexibility in-system.
SEARAY also features Samtec’s patented Edge Rate® contact system. Edge Rate is a rugged contact that is designed for high speed, high bandwidth applications like the Jetson platforms. The contacts are positioned in the plastic body to minimize broadside coupling and crosstalk.
Edge Rate contacts mate on the smooth milled surface of the contact. This allows for higher cycle life and superior electrical properties. This contact design also lowers insertion/extraction forces while enabling “zippering” when mating and unmating the connectors.