Samtec continues to expand its line of shielded interconnects, both board-to-board and cable-to-board systems. These are used in a variety of industries and applications, one being industrial equipment. Shielded interconnects are a good thing because EMI is a four-letter word for most designers. I do and don't mean that literally, although I do know there are three types of people in this world: those who can count and those who can't. Anyway, not to be Captain Obvious, but most … [Read more...]
PLDA and Samtec Demonstrate PCIe 4.0 over FireFly™ Micro Flyover System™
PLDA and Samtec recently announced a demo of their combined PCIe 4.0 solution that delivers full PCIe 4.0 bandwidth (16 GT/s) over copper or optical fiber at minimal cost. The joint demonstration combines PLDA’s PCIe 4.0 IP solutions with Samtec’s FireFly™ Micro Flyover System™. It delivers PCIe 4.0 speed without the use of retimers or updated motherboard using MEGTRON 6 other exotic laminates. This demo suggests a solution to overcoming the inherent limitations of maintaining PCIe 4.0 … [Read more...]
High Speed Interconnect Demos At Electronica 2018
Samtec's full line of high speed interconnect products was on display and in demonstrations at Electronica 2018. Focus products included high speed mezzaninehigh speed cable assemblieshigh speed backplane connectorsactive optical cable assemblies Two of the demos that caught a lot of attention were the 28 G Product Demonstrator and the REFLEX CES Sargon Stratix 10 FPGA FMC+ IDK. 28 G Product Demonstrator In this video, Samtec's Neil Potter walks us through the 28 G … [Read more...]
Integrated Circuit Packaging and GCT
If you aren’t from the packaging world, then chances are likely you might think “packing” refers to objects being placed in to a box instead of packaging integrated circuits (IC’s) on a substrate. Packaging has advanced since it began, and as with many areas it is all in effort to save space, obtain faster speeds, and to lower costs. Without advances in packaging, we can’t get smaller phones, medical implantables and wearables, or even smaller sensors on an autonomous car. 2D, 2.5D, and 3D … [Read more...]
New Products, New Technologies, New Location At Electronica
Samtec is presenting new products and new technologies at Electronica 2018, as well as our full line of interconnects including High Speed Board-to-Board, High Speed Cable Assemblies, Micro/Rugged, Flexible Stacking, Optics and Precision RF. We are in a new location this year: we’re still in Hall B3, but we’re now at Stand 129, across from Molex. If you're at Electronica stop by and visit. If you're not in Munich you may still be interested in some of the new products we … [Read more...]
Samtec Features Latest High-Performance Copper and Optical Solutions at SC18
Next-generation high-performance copper and optical interconnects must solve multiple technical challenges including higher data rates, increased system and chassis density, and improved signal integrity. Samtec’s diverse product and technology portfolio provides system designers architectural solutions to the challenges faced by the industry. Several key solutions will be featured at SC18. SC18 Demonstrations Samtec and its partners feature an extensive number of demos at SC18. A … [Read more...]
Samtec “Focuses” on Embedded Vision Systems
Embedded vision systems are commonplace in everyday applications. As an example, ADAS systems in modern automobiles increase driver and passenger safety. In another application, visual inspection systems reduce manufacturing errors on the production line. Additionally, drones are revolutionizing data collection for consumers, researchers and enterprises alike. Embedded vision system components continue to advance in complexity. However, they all need connecting at the … [Read more...]
New Catalog, New Products
Yeah, we know it's the digital age, but we still print catalogs because a lot customers still ask for them. We print less than we used to, but they're still available. Our new F-219 catalog was just released and it includes at least 34 new product series. Most are available and some are soon-be-released, but here's a summary of some of the new products that I think are particulary cool: NovaRay™ Samtec’s NovaRay™ is an industry-leading high bandwidth, high-density interconnect … [Read more...]
Samtec Demos High-Performance Platforms at XDF Silicon Valley
Samtec recently sponsored and attended the Xilinx Developer Forum (XDF) in Silicon Valley. XDF connects software developers and system designers to the deep expertise of Xilinx engineers, partners, and industry leaders. During the event, Samtec showed two high-speed demonstrations. Both platforms marry Samtec interconnect solutions with Xilinx silicon. The XDF demos are featured in the following videos. Samtec’s FQSFP-DD SI Evaluation Kit As data rates increase, trace … [Read more...]
Reach Beyond the Rack – Samtec/eSilicon 56G 5m Backplane Cable Demo to Debut at SC18
As data centers get faster and more complex, component suppliers must help system architects reach beyond the rack. The first-to-market solution from eSilicon and Samtec demonstrates high-performance connections between backplanes instead of the front panel. All are invited to see the demonstration in Samtec booth #521 at SC18. eSilicon 56G long-reach 7nm DSP SerDes Reach beyond the rack over 5m of copper cable? How? At 56G PAM4 data rates? That can't be right, is … [Read more...]
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