Samtec recently completed an arduous flex and bend test on our Eye Speed® Ultra-Low Skew Twinax cable. This is used in our high speed cable assemblies, including the Samtec Flyover™ FQSFP-DD cable assembly. Besides achieving outstanding electrical performance, the testing has proved the cable to be rugged and provide stable electrical performance after repeated cycles. QSFP-DD 101 QSFP-DD is a new module and cage/connector system similar to current QSFP, but with an … [Read more...]
Advanced RF and Optical Connectivity Drives New VPX Platforms
The number of embedded computing architectures, including VPX, seems to grow daily. Interoperability, economies-of-scale and multiple sources are benefits customer demand in any solution. VPX - and by extension OpenVPX - continues to grow in popularity. These VITA-defined architectures combine the latest connector and electro-mechanical technology with the most popular high-speed protocols on the market. VPX/OpenVPX are point-to-point architectures supporting start, dual-star, … [Read more...]
Samtec Releases New Protocol Capabilities for High Performance Interconnect
"Which Samtec connectors and cable assemblies support (pick a protocol)?" That is one of the most common questions asked of Samtec sales and support teams. That is natural because many engineers know what protocols and data rates need supporting in their designs. Sometimes the answer is straightforward. Samtec's PCI Express® Edge Card Connector (PCIE series) supports the latest PCIe data rates. In other cases, the answer is more nuanced. Protocol support depends on any number of … [Read more...]
DINI Group Leverages Samtec FireFly™ for Low Latency HPC
Blockchain. Cryptocurrencies. Bitcoin mining. Algorithmic trading. These disruptive technologies depend on high-performance computing platforms for reliable execution. The financial services industry invests billions in hardware to support the near real-time services consumers require. Many financial services computing applications rely on x86-based server solutions. Alternative computing architectures leveraging the benefits of FPGAs are emerging. A combination of FPGA configurability, … [Read more...]
Extreme Density, Micro Edge Card Socket for Cost Optimization
Samtec has released the industry’s first 0.50 mm pitch edge card socket with justification beam. This design allows high-speed signals to pass through an incredibly dense connector while keeping the mating PCB at a reasonable cost. The socket’s justification beam is designed to shift the card into proper alignment with the contacts. This allows for standard board tolerance on cards that typically would not work with ultra-fine pitch connectors. Manufacturing costs are then optimized … [Read more...]
New Automotive and Storage Platforms Include Samtec Interconnect Solutions
Embedded engineers - hardware, software and firmware - are constantly challenged to get products to market quickly. Consequently, electronics components manufacturers and their partners are easing this process. Innumerable references designs, evaluation boards and development kits accomplish this goal. Two new solutions available from Neutron Controls and Crossfield Technology are targeted at specific applications. Similarly, they both feature unique, high-performance interconnect … [Read more...]
Samtec and IEEE-P370 Partners Win A DesignCon Best Paper Award
A key component of any high-speed signal path is the interconnect. Design engineers must identify the right connector (or connectors) and the best performance for the application. At 56 Gbps PAM4 data rates (and higher), connector selection becomes more challenging. Interconnect manufacturers like Samtec make connector performance data readily available to support the connector selection process. Measured data in the form of S-parameters are often the most trusted, but just how … [Read more...]
Connector Designs To Address Data Rate and Density Challenges
Demand For High Data Rate As the need for bandwidth continues to increase, so does the need for higher data rates within a system. What was once one to three Gbps, then moved to 4 to 8 Gbps, and now we are approaching 28 Gbps and looking forward to 56 G. This trend was recently driven home at DesignCon 2018, where many exhibitors were demonstrating interconnects running at 112 Gbps PAM 4. Although the Datacom and Telecom industries are abuzz pushing these cutting-edge data rates, … [Read more...]
Samtec Releases New Silicon-to-Silicon Application Solutions Guide
Samtec is pleased to announce the new Silicon-to-Silicon Application Solutions Guide. This updated guide details the evolution of Samtec technologies, products and technical support available for next-gen system data rates. 56 Gbps PAM4. 56 Gbps NRZ. 112 Gbps PAM4. Whatever the data rate, Samtec's Silicon-to-Silicon ecosystem of SI expertise, system design and testing, high-performance validation and online design tools offer customers an ideal development partner. Samtec … [Read more...]
Samtec and Molex Collaborate on Next-Generation Twinax Data Center Solutions
Two global leaders in the design and manufacture of interconnects for high-performance electronic products today announced a Licensed Source Agreement (LSA) which brings together innovations that provide a new generation of solutions to meet the evolving needs of 56G and 112G data speeds. Samtec and Molex are the only suppliers licensed to offer the Samtec Twinax Flyover™ and Molex BiPass™ solutions. The combined solutions answer the needs of the growing number of high-speed applications … [Read more...]
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