Next generation super computers, quantum computing, AI engines, and high-performance emulation systems are all evaluating the benefits of liquid cooling. Liquid cooling removes the heat more efficiently than airflow, eliminates the noisy, power-hungry fans used in traditional air-cooled systems and enables denser, more-efficient processing boards and systems. One technology holding back the adoption of liquid cooling has been the lack of optical transceivers which perform … [Read more...]
10 Reasons To Visit Samtec At DesignCon 2019
DesignCon is one of my favorite conferences/exhibitions because there is so much going on. DesignCon has the latest state-of-the-art design methodologies, applications, technologies, and tremendous networking opportunities. Booth 737 -- the Samtec booth -- is the epicenter of the show; it's where all of the important people hang-out (that's why you won't see me there). I don't have room to list everything going on at the Samtec booth, so I've selected 10 items that I think are the most cool. … [Read more...]
112 Gbps PAM4 Samtec Flyover™ Live Demonstration
112 Gbps Samtec Flyover™ Demo Samtec’s Ralph Page walks us through a live demonstration of a Samtec Flyover™ system which enables 112 Gbps PAM4 performance. The Credo CDR generates two ports of 31-bit PRBS data at 112 Gbps PAM4 data rates. The signal travels from the Credo Pelican II SERDES test board through precision RF cable assemblies, to a Samtec Flyover™ QSFP-DD SI Evaluation Kit. This cable assembly, approximately 12” (30.5 cm) long, uses Samtec 34 AWG Eye Speed® Ultra-Low … [Read more...]
Rearchitected OCP Wedge Switch Using Samtec Flyover™
In this video from SC18, Jignesh Shah of Samtec’s High Speed Connectivity Group walks us through a demonstration of a rearchitected Open Compute Project (OCP) wedge switch. By rearchitected we mean it utilizes Samtec Flyover™ high-speed cable assemblies to achieve next gen speeds by routing signals via ultra-low skew twinax cable instead of through the PCB, as in conventional architecture. The system has a 12.8 Tb Marvell ASIC with 32x QSFP-DD ports on the front panel, sending signals at … [Read more...]
Samtec and REFLEX CES Demo New FPGA/FireFly™ Platforms
"Another blog about FPGA Development Kits? Again? Come on Samtec! Put something else up on the blog!" Umm . . . not today. Sorry! That quote may, or may not, be a comment Samtec bloggers have heard before. In any case, readers of the Samtec blog know FPGAs are a constant topic, Why? FPGA-based solutions combine flexibility and high-speed performance in small form factors. They are found in any number of unique applications. In both cases, these are common traits of … [Read more...]
New Signal, Power Edge Card Connector
The HSEC8 series, a high-speed edge card socket on .8 mm pitch, is our most popular edge card connector, and one of our biggest selling products series. New Signal, Power Card Edge Connector A recently released option on the HSEC8 is a signal, power card edge combo connector. The HSEC8-PV is available with one or two banks of power pins. Each bank contains two power pins, and each bank is rated up to 60 amps. Through-hole tails on the power pins are designed for .062” (1.60 mm) and .093” … [Read more...]
Fan-Out Wafer-Level Packaging
Advances in packaging have afforded companies the ability to place a larger number of contacts in smaller footprints, improve the thermal characteristics, and improve the electrical performance of their systems. One of these advances comes in the form of Fan-Out Wafer-Level Packaging (FOWLP). FOWLP offers an improvement over wafer-level packaging (WLP), and was developed to provide a greater number of external contacts with a silicon die. How does it work? The … [Read more...]
Samtec Releases New FireFly™ Video
We talk about FireFly™ a lot around here, and why not? With the industry’s leading miniature footprint enabling maximum signal density and SI over longer distances, we assume you want to hear about it. FireFly™ Micro Flyover System™ provides high-performance versatility by taking the data connection “off board” for higher data rates up to 28 Gbps per lane with a path to 112 Gbps PAM4. In addition, the miniature footprint allows for higher density and closer proximity to the IC. The results … [Read more...]
56 Gbps, 5 Meter Backplane Cable Assembly Demo
A joint demonstration between Samtec and eSilicon -- an eSilicon 7 nm 56 Gbps DSP SerDes over a Samtec 5 meter ExaMAX® backplane cable assembly -- caught a lot of attention at SC18. The demo showed a true long-reach capability with a high-performance, flexible, easy-to-configure SerDes that targets common data center standards and data rates. In this video Samtec’s Ralph Page and eSilicon’s Roberto Massolini walk us through the demo, explaining the logistics and the results … [Read more...]
Increasing Broadband Interconnect Characterization
Samtec's Gustavo Blando recently presented "Increasing Broadband Interconnect Characterization" at EDI CON 2018 in Santa Clara, California. A video of the workshop is above, and below is Gus's summary of his presentation. VNA measurements are the backbone of any SI analysis, both for correlation and basic interconnect understanding. As bit rate increases and specs tighten, accurate measurement at higher frequencies is of paramount importance. For convenience, a coaxial style connector is … [Read more...]
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