Samtec Releases New FireFly™ Video

We talk about FireFly™ a lot around here, and why not? With the industry’s leading miniature footprint enabling maximum signal density and SI over longer distances, we assume you want to hear about it.

FireFly™ Micro Flyover System™ provides high-performance versatility by taking the data connection “off board” for higher data rates up to 28 Gbps per lane with a path to 112 Gbps PAM4. In addition, the miniature footprint allows for higher density and closer proximity to the IC. The results are a simplified board layout, enhanced signal integrity from IC to faceplate and reduced power dissipation.

Available in copper and optical, there is a solution for any application whether cost is a factor or greater reach is required. Both systems use the same two-piece, low insertion force connector system with surface mount tails to eliminate through-holes in the board. FireFly™ is a simple to use system with easy insertion/removal and trace routing.

From high-density and rugged end options to a choice of fiber types and heat sinks for various cooling processes, FireFly™ has incredible flexibility for a variety of applications. There are also several versions of FireFly™:

• ECUO: FireFly™ Optical
• ETUO: Extended Temperature FireFly™ (-40 ºC to +85 ºC)
• PCUO: PCIe®-Over-Fiber FireFly™ (Gen 3; Gen 4 in development)
• PTUO: Extended Temperature, PCIe®-Over-Fiber FireFly™ (-40 ºC to +85 ºC and -5 ºC to +85 ºC)
• PCOA: PCIe®-Over-Fiber Adaptor Card with FireFly™ (Gen 3; Gen 4 in development)
• ECUE/ECUE-2: FireFly™ Standard Copper (14 Gbps) and Optimized Copper (28 Gbps)
• PCUE: PCIe®-Over-FireFly™ Copper (Gen 4 compatible)

Characterization and Development Kits featuring FireFly™ optical are also available. See samtec.com/kits for information.

Check out the new video above, visit samtec.com/firefly or contact firefly@samtec.com for more information.