Readers of the Samtec blog know the benefits of Twinax Flyover™ solutions. Faster data rates can be supported over longer distances. How? Easy. Get signal routes out of noisy and lossy PCB into ultra-low-skew twinax cable. Many applications that use Twinax Flyover solutions are found in the data center. Applications typically include servers, storage, network switches/routers and other communication equipment. Twinax Flyover solutions are finding homes in more FPGA … [Read more...]
Samtec Introduces New SI Evaluation Kits
Any engineer who has designed an IC-based solution likely used some sort of HW development tool. Semiconductor manufacturers have a long history of providing engineers with the HW tools needed to test their silicon. Evaluation platforms, like the Xilinx® Zynq UltraScale+ RFSoC ZCU111 Evaluation Kit, provide the ideal development environment for evaluating the cutting edge silicon. The ZCU111 provides easy access to the power, I/O memory and interface circuitry required for the RFSoC to … [Read more...]
EDI CON 2018: New Products, New Technologies
EDI CON USA brings together RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators for networking, product demonstrations, training, and learning opportunities. And as you have probably already guessed, Samtec will be attending EDI CON. We will be presenting two workshops (more on this below), displaying and demonstrating our RF interconnect solutions, including our expanding line of precision RF interconnects, as well as high-speed/high-density … [Read more...]
Products, Technologies, Demos at OCP Europe
OCP Europe and Samtec OCP Europe is quickly becoming a leading technology event for the data center industry. As a leader in high-speed connectivity, Samtec will demonstrate multiple Silicon-to-Silicon system optimization architectures. Samtec application engineers and signal integrity experts will be on to provide details on these new system-level solutions. Two demonstrations will be front-and-center at our booth (booth #A23). The first is a fully-functional 12.8 Terabit … [Read more...]
Samtec Sponsoring 2018 Xilinx Developers Forum
One of the biggest events in the FPGA/SoC ecosystem is the annual Xilinx Developers Forum (XDF). XDF connects software developers and system designers to the deep expertise of Xilinx engineers, partners, and industry leaders. XDF takes place in three locations this year. Samtec will be attending all three locations as shown below: XDF Silicon Valley - October 1-2, 2018XDF Beijing - October 16, 2018XDF Frankfurt - December 10, 2018 Samtec High-Performance Interconnect Samtec … [Read more...]
Innovative High Speed Solutions With One Up Studio
One Up Studio is a hardware design engineering provider with a focus on signal integrity, and not coincidentally, a Samtec customer. I caught up with Paul Monar, the owner, to pick his brain about some interesting design challenges he faces at One Up and his connector system selection criteria. DANNY: What type of customers use One Up Studio? Why? PAUL: Most of our customers are newer IoT companies with products including smart home devices, wearables, industrial control, and … [Read more...]
New COTS Embedded Computing Platforms Incorporate FireFly™ for Density and Performance
Small footprints. Less weight. Signal integrity over longer distances. Scalability. Upgradeability. These and other factors are driving the adoption of optical engines in embedded computing. Annapolis Micro Systems, a leading FPGA board and systems supplier, and Samtec have collaborated to integrate the Samtec FireFly™ Optical System in multiple COTS embedded computing platforms. FireFly enables maximum signal density and SI over longer distances. New FireFly … [Read more...]
New Avnet UltraZed-EV SoM Features Samtec SEARAY™ 0.80 mm High-Density Arrays
Samtec distributor partner Avnet recently released its new UltraZed-EV Starter Kit targeted at embedded vision applications. Comprised of the UltraZed-EV SoM and the UltraZed-EV Carrier Card, this kit offers engineers and designers a complete platform for prototyping and evaluating embedded video processing systems. The Avnet development team worked with Samtec to identify SEARAY™ 0.80 mm Pitch Ultra High-Density Arrays as the mezzanine connector between the SoM and Carrier Card. The … [Read more...]
Packaging Innovations For Medical Wearables
Steve Groothuis -- or Groot to everybody else on this planet -- Chief Technology Officer of Samtec Microelectronics, recently presented “Packaging Innovations For Medical Wearables” at the Medical Wearables Conference in Santa Clara, California. Groot’s presentation focused on the specific needs, challenges, and innovations within upcoming medical applications and medical device packaging. We caught up with Groot and asked him about the presentation and its message. DANNY: Steve, … [Read more...]
Samtec Updates Homepage With Silicon-to-Silicon Focus
As the industry evolves, data rate requirements continue to increase at a rapid pace, approaching and even surpassing 56 Gbps. As this continues, developers are challenged with balancing increasing throughput, scalability and density demands with concerns such as power consumption, signal integrity, cost and time-to-market. Samtec helps address these challenges with industry-leading expertise in high-performance interconnect design, system optimization, and innovative strategies and … [Read more...]
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