Yeah, we know it’s the digital age, but we still print catalogs because a lot customers still ask for them. We print less than we used to, but they’re still available.
Our new F-219 catalog was just released and it includes at least 34 new product series. Most are available and some are soon-be-released, but here’s a summary of some of the new products that I think are particulary cool:
Samtec’s NovaRay™ is an industry-leading high bandwidth, high-density interconnect system. The innovative pin-to-ground differential pair configuration enables very low crosstalk to 40 GHz+, tight impedance control, and minimal variance in data rate as stack heights increase. The system is 112 PAM4 capable and is rated up to 56 Gbps NRZ per channel.
It boasts an industry-leading aggregate average data rate of 1.33 Tbps per square inch. The 92 Ω impedance rating addresses both 85 and 100 Ω applications. An improved breakout region has been developed using a new offset signal-to-ground configuration.
Flyover QSFP28 Double Density
The Samtec Flyover™ QSFP28 Double Density form factor focuses on a next generation high-density, high-speed pluggable backward compatible module form factor. The system’s pluggable modules support double the aggregate bandwidth of conventional QSFP modules by adding a second row of contacts, which enable support for a 16 differential pair electrical interface.
The FQSFP-DD Samtec Flyover™ product meets this challenge with greater performance margin compared to the QSFP-DD connector-to-PCB approach. As advanced 50 Gbps+ per channel ASIC and FPGA solutions hit the market, a next-generation Samtec Flyover system that overcomes the limitations of signal loss on a PCB trace continues to become more relevant.
mPower (Ultra Micro Power)
A new product that is getting a lot of attention is the Ultra Micro Power system, the UMPT and UMPS series. It offers design flexibility as a power-only interconnect system or a two-piece system for power/signal applications. Mated heights of 5, 7, 8, and 10 mm allow UMP connectors to be used for power with other popular Samtec high-speed connector systems.
Rated at 17.1 amps per blade, on 2 mm pitch, with tin or 10µ” gold plated power blades, these small form factor interconnects are available in a choice of 2, 3, 4, and 5 pin counts, with optional weld tabs for increased mechanical strenght of the part to the board.
High-Speed Backplane – ExaMAX® and XCede® HD
ExaMAX® Direct Mate Orthogonal solutions remove the mid-plane, which allows fabric cards and line cards to mate directly and ultimately giving system designers increased flexibility. This architecture increases airflow and improves thermal efficiencies throughout the chassis. It also improves signal integrity, with shorter trace lengths and fewer connector transitions.
Leading equipment vendors from across the data center industry are leveraging the advantages of DMO, including storage, server, networking and other applications.
XCede® HD achieves significant space savings and flexibility on the backplane with a small form factor and modular design. A 1.80 mm pitch and up to 84 differential pairs per linear inch provide greater density than traditional backplane systems.
The modularity of XCede® HD gives designers the flexibility to create any configuration for a specific application. Modules include signal, power, guidance/keying and end wall options for increased system durability.
High Density, Rugged Signal Integrity
The rugged Edge Rate® contact system is designed, simulated and optimized for 50 Ω and 100 Ω systems and is rated at 56 Gbps PAM4. The new ERM6, ERF6 series, .635 mm pitch terminal and socket strips, have an extremely slim 2.5 mm body width to optimize board density. It is available with up to 120 positions in a two row design. The 120 position system has a small footprint of 107.15 square mm (.165 square inches).
Ultra High Density Edge Card
Samtec’s new 0.50 mm pitch edge card socket, the MEC5 series is available in vertical and right angle designs. This new product is the industry’s first 0.50 mm pitch edge card socket with a justification beam.
This socket meets the demands for higher density and bandwidth (it’s rated at 56 Gpbs PAM4) while also optimizing cost. It’s PCIe Gen 4 compliant, and is available with up to 300 total I/Os with weld tabs to increase the mechanical strenght of the part to the board.
Check out this video to learn more about the MEC5 series and the unique justification beam.
Samtec’s AcceleRate® HD is a 0.635 mm pitch, multi-row interconnect system that provides an ultra-high density interface and next-generation bandwidth. It features up to 240 total I/Os in a mere 1.88 square inch (12.1 square cm) of PCB real estate.
The mated stack height is a low 5 mm, with 7 mm and 10 mm stack heights to follow. The system incorporates the Edge Rate® contact system, which is optimized for signal integrity performance. It is rated to 56 Gbps with PAM4 modulation. This is Samtec’s ADM6, ADF6 Series.
AcceleRate® Cable Assembly
Another new product that’s getting a lot of attention is the AcceleRate® cable assembly. It’s the slimmest in the industry with a 7.6 mm body width ideal for closer proximity to the IC. The high-density 2-row design features 8 and 16 pair configurations on a 0.635 mm pitch for up to 92 pairs per square inch.
Rated to 56 Gbps PAM4, this assembly supports Samtec Flyover™ technology by avoiding over lossy PCB via ultra-low skew twinax Eye Speed® cable. This proprietary co-extruded cable supports next-generation performance with extended reach and system flexibility. The mating pcb level connector is the ARF6 series.
Again, the new catalog lists 34 new products so I’m just scratching the surface with the list above. Here are some links if you want to snoop around our product offering. Or, contact the friendly people in the Application Support Group and tell us what you need and we’ll get started.