As with many things, nothing stays the same; especially in the world of technology. Samtec continues to improve and refine its offerings with Glass Core Technology (GCT), and with that there is also a need to update the materials surrounding it.
Tell me more
Through Glass Vias (TGV), Redistribution Layer (RDL), and Microchannels and vias all play a part in Samtec’s ability to provide customers with GCT allowing miniaturized designs and increasing performance. Below are the current capabilities in these areas that Samtec showcases in the video.
TGV Capabilities
- 300 µm thick glass is typical
- TGVs with 10:1 aspect ration
- Tapered and cylindrical TGV profiles
RDL Capabilities
- 1 – 2 metal layers per side
- 1 – 4 µm copper thickness
- 1 – 8 µm polyimide thickness
Microchannels and Via Capabilities
- Lab-on-chip application design
- Fluidic structures for electronic cooling
- Microfluidic structures for biomedical devices
What can we do with that?
Because Samtec is proficient in these capabilities it enables development expertise in Glass Core Packaging and Glass Core Fan-Out Wafer Level Packing. Microchannels and via capabilities allow for microfluidic mixing, lab-on-chip, electrophoresis, MicroTAS, and DNA analysis for biomedical; RF MEMS; Optics, Imaging, and Photonics; 2.5D and 3D Packaging; and Optoelectronics.
Make sure to check out the video below, and contact [email protected] or visit www.samtec.com/GCT for more information.