Samtec’s full line of high speed interconnect products was on display and in demonstrations at Electronica 2018. Focus products included
- high speed mezzanine
- high speed cable assemblies
- high speed backplane connectors
- active optical cable assemblies
Two of the demos that caught a lot of attention were the 28 G Product Demonstrator and the REFLEX CES Sargon Stratix 10 FPGA FMC+ IDK.
28 G Product Demonstrator
In this video, Samtec’s Neil Potter walks us through the 28 G Product Demonstrator. This is an active system that showcases Samtec interconnect products at 28 Gbps and beyond. The Demonstrator is a small version of a real system. It uses active retiming devices at 28 Gbps, for short reach and medium reach channels, and it incorporates most of Samtec’s 28 Gbps products.
REFLEX CES Sargon Stratix 10 FPGA FMC+ IDK
In this second video, Neil guides us through a demo of the REFLEX CES Sargon Stratix 10 FPGA FMC+ IDK. The REFLEX CES board incorporates Samtec’s VITA 57.4 SEARAY™ connector system with an FMC plug-in card carrying two FireFly™ active optical modules (one Tx, one Rx).
New Products At Electronica
Several new products were on display at Electronica. A few that you might be interested in include:
mPower (Ultra Micro Power)
The new Ultra Micro Power system, the UMPT and UMPS series, offers design flexibility as a power-only interconnect system or a two-piece system for power/signal applications. Mated heights of 5, 7, 8, and 10 mm allow UMP connectors to be used for power with other popular Samtec high-speed connector systems. They are rate at 17.1 amps per blade, on 2 mm pitch, with tin or 10µ” gold plated power blades.
Ultra High Density Edge Card
This socket meets the demands for higher density and bandwidth (it’s rated at 56 Gpbs PAM4) while also optimizing cost, and it’s PCIe Gen 4 compliant.
Check out this video to learn more about the MEC5 series and the unique justification beam.
AcceleRate® Cable Assembly
Samtec’s AcceleRate® cable assembly is the slimmest in the industry with a 7.6 mm body width ideal for closer proximity to the IC. The high-density 2-row design features 8 and 16 pair configurations on a 0.635 mm pitch for up to 92 pairs per square inch.
If you want more information on any of the above please contact Samtec’s Application Support Group.