Thursday is another day in the books here at electronica 2016. The Samtec booth continues to see high traffic from customers, vendors, partners and distributors. What is generating the most interest today? See below: High-Speed Edge Card Systems Designers and engineers here at electronica 2016 have a high degree of trust in tried-and-true interconnect solutions. Samtec's High-Speed Edge Card Systems offer several options providing flexibility in system design. Some key features … [Read more...]
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Lots To See At Electronica 2016
Electronica, in Munich, Germany, 8-11 November, is one of the leading trade fairs in the electronics industry. The best ways to describe it are simply huge, overwhelming (in a good way), and state-of-the-art. If you're visiting the show, we would love to see you at Hall 3, Booth 407. Samtec will be presenting its full line of interconnects, including High Speed Board-to-Board, High Speed Cable Assemblies, Micro/Rugged, Flexible Stacking, Optics, and IC-to-Board Systems. Probably … [Read more...]
October Web Updates to Samtec.com
If you're a regular user of Samtec.com, October was a great month for you! We brought you some exciting new design tools, a major homepage refresh, and a couple of huge new pieces of content for you to devour. Here are the major web updates for the month of October. Solutionator 2.0 Continues to Evolve In September, we brought you the all new release of our Solutionator tool, which is a parametric search tool designed to help you design your mated connector set in a minute or … [Read more...]
Best Practices For Connector Models
Eric Bogatin, Signal Integrity guru and friend of Samtec, recently posted a blog on “Best Practices For Connector Models.” He posted this on his Signal Integrity Journal website. Eric spoke with two of the worlds’ experts on high frequency electrical characterization of interconnects: Samtec’s own Jim Nadolny, our Principle SI Engineer, and Heidi Barnes, the ADS application engineering specialist with Keysight Technologies. Heidi and Jim cover a lot of topics, from S-parameter … [Read more...]
The Grounds Behind Grounding
A few weeks ago, I was working on an audio amplifier with my dad in the garage. As I began to wire it up to test a new set of speakers we had bought, I received a nasty shock when plugging in an older, frail patch cable. Now, something didn’t seem to add up here; I had used this cable before on my equipment and never had problems. However, in this instance, something was different; the older tube amplifier we were using had no ground. In today’s industry and even in household use, electrical … [Read more...]
Samtec’s Glass Core Technology Featured at IMAPS 2016
IMAPS - International Microelectronics Assembly and Packaging Society - in one of the biggest events of the year in the IC Package and Assembly industry. Last week at IMAPS 2016, Samtec Microelectronics highlighted our world-class complex package and assembly capabilities and our emerging Glass Core Technology (GCT). Samtec's IC package and assembly capabilities include precision die attach, ultra-fine pitch wire bonding, expertise in packaging and substrate design, stacked … [Read more...]
Avnet Zynq Transceiver Evaluation Kit Features Samtec RF Cable Assemblies
Engineers constantly face challenges routing multi-gigabit transceivers (MGTs) throughout their systems. The new Avnet Zynq Transceiver Evaluation Kit (AZTEK) provides a low-cost reference design that streamlines evaluation of FPGA SoC MGTs that require transmission of large amounts of data at high communication rates or over long distances. The AZTEK kit uses Samtec’s SMA RF316 cable assemblies that reliably route high data rate signals in industrial, consumer, medical and … [Read more...]
Samtec Expands ExaMAX® High-Speed Backplane Connector System
Samtec proudly announces the expansion of the ExaMAX® High-Speed Backplane Connector System optimized for high-density and high-speed performance. The scalable ExaMAX® system meets today’s data rates while providing a future-proof path for next generation architectures. The ExaMAX® header and right-angle receptacle system (EBTM/EBTF-RA Series) is optimized for speeds up to 28 Gbps on a 2.00 mm column pitch or 56 Gbps on a 3.00 mm column pitch. For 28 Gbps performance, this system meets and … [Read more...]
Samtec Featured in Latest Avnet AXIOM Online Magazine
Engineers need constant updates on the latest technology trends, design tips, new product information and other relevant design-oriented topics. The latest version of Avnet's AXIOM online magazine is a great source dedicated to these purposes. The latest issue of AXIOM focuses on new products and technologies from Avnet's partners like Samtec. Samtec content is featured in three different areas of this current issue. Click the links below for more … [Read more...]
Samtec Releases “Expanding the Backplane Ecosystem” ChalkTalk
Samtec is pleased to announce a new ChalkTalk entitled "Expanding the Backplane Ecosystem." Hosted by EEJournal, this newly released ChalkTalk details the growing backplane connector portfolio from Samtec. Samtec entered the backplane connector market by licensing FCI's ExaMAX® High-Speed Backplane Connector System. Over the past few years, Samtec has developed numerous soon-to-be-released backplane connector mated pairs. Samtec has also developed power delivery and guide post … [Read more...]
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