Samtec proudly announces the expansion of the ExaMAX® High-Speed Backplane Connector System optimized for high-density and high-speed performance. The scalable ExaMAX® system meets today’s data rates while providing a future-proof path for next generation architectures.
The ExaMAX® header and right-angle receptacle system (EBTM/EBTF-RA Series) is optimized for speeds up to 28 Gbps on a 2.00 mm column pitch or 56 Gbps on a 3.00 mm column pitch.
For 28 Gbps performance, this system meets and exceeds OIF-CEI-28G-LR specifications. Return loss compliance is achieved in both 85 Ω and 100 Ω systems due to targeting the 92 Ω specifications and controlling reflections at all geometry transitions within the connector.
Further details can be found in our press release from today.
Learn more about the ExaMAX® backplane connector system in the following resources:
- Samtec Releases “Expanding the Backplane Ecosystem” ChalkTalk
- ExaMAX® eBrochure
- ExaMAX® Application Specification
- Xilinx 28 Gbps Backplane Demo
- ExaMAX® Impedance Technical Note