Centerlines to 0.4 mm. Gold plating that is 5μ” thick. Contact systems rated at 30 Gbps. Connectors that can handle 10,000 cycles. While our expectations are high, we all know that developing the next generation interconnect solutions requires constant engineering and manufacturing innovation. And while connectors aren’t at the top of the electronics food chain, their role is critical in the successful functioning of any electronic system. The Samtec Advanced Interconnect Design Technology … [Read more...]
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BBC R+D Leverages FMC for Audio Codec Replacement
Our friends at Xilinx recently blogged about how the BBC R+D department replaced a 32-year old small rack-mount audio codec with low-cost off-the-shelf solutions customized to fit the BBC's needs. According to Justin Mitchell, principal engineer at BBC R+D, this project occurred since the original audio codec could no longer be supported due to component aging and a lack of parts. The heart of the new system is the Xilinx Zynq SoC found on the low-cost ZedBoard development kit available from … [Read more...]
Guidelines To Ensure Electromagnetic Immunity In Connectors
Electromagnetic Immunity is the ability of a system to continue functioning in the presence of electrical noise. One can imagine a scenario where an automobile drives under a cell phone tower. If the automobile accelerates to 120 mph due to coupled noise in the engine controller from the cell phone tower, one can say that the automobile is vulnerable to noise from the cell phone tower. Regulations This simple (but dramatic) example illustrates the need for immunity testing and requirements … [Read more...]
Chip-to-Chip at 25 Gbps+ . . . Over Fiber?
As another year dawns, the demand for data remains insatiable. The number crunching of Big Data requires larger and faster supercomputers to analyze immeasurable data sets. New server architectures leverage hardware accelerators – in FPGAs or via expansion cards – to offload system processing. The growth of the IoT gives rise to data acquisition systems aggregating GBs of data. High-speed test and measurement equipment emulate signal traffic found in next generation routers, switches and … [Read more...]
Arrow-Built SF2+ Dev Kit Features Samtec
Integration. Integration. Integration. More and more SoCs from the leading semiconductor manufacturers have just about everything but the kitchen sink in their devices. Some of these options include MCU cores, programmable logic, wired and wireless connectivity, memory controllers and high-performance serial communication interfaces. While Xilinx and Altera continue to dominate the SoC/FPGA market, MicroSemi continues to launch innovative, niche solutions. The … [Read more...]
Check Out The New Samtec Optical Group Video
Check out the new Samtec Optical Group video. The Samtec Optical Group is an engineering team dedicated to the design, development and application support of high performance micro optical engines, active optical assemblies and high density ganged passive optical panel solutions. Capable of 14 Gbps, 28 Gbps, and soon 56 Gbps, Samtec’s FireFly™ micro on-board optical engines occupy the smallest overall footprint, consume the least amount of power, and enable fast, easy, and low cost fiber … [Read more...]
High Speed, High Density Right Angle Socket Array Saves 50 Percent Board Space
Samtec’s new high speed, high density right angle socket array - SEARAY™ 0.80 mm pitch - is ideal for perpendicular board-to-board and micro backplane applications with up to 50 percent board space savings compared to .050" (1.27 mm) pitch SEARAY™ interconnects. The open pin field design allows for maximum grounding and routing flexibility with up to 500 total Edge Rate® contacts. This ultra high density right angle socket array (SEAF8-RA Series) features: a choice of 8 or 10 … [Read more...]
Bulls Eye® Test Point Solutions Ease Transceiver Characterization
Semiconductor manufacturers are always looking for the best interconnect solution to characterize the high-speed transceivers found on their FPGAs, ASICs and ASSPs. Typically, PCB-mount SMA connectors have been used to breakout the differential transmit and receive signals found in modern transceivers. Below is a Xilinx Spartan-6 FPGA SP623 Characterization Kit which features a number of PCB-mount SMA connectors. This approach worked for decades. Transceiver counts per IC … [Read more...]
Join Us at DesignCon 2016
Check out Samtec’s Silicon-to-Silicon System Optimization products and technologies, including Channelyzer™ online full channel simulation and analysis tool, QSFP Flyover™ System, Z-Ray® One Piece Interposer, ExaMAX® High Speed Backplane, and SEARAY™ Open Pin Field Array interconnects. About Samtec | Featured Products | Presentations | Passes About Samtec Samtec, Inc. is an international supplier of interconnects, cable assemblies and design solutions. We focus on system optimization by … [Read more...]
A Look Inside Samtec’s High Speed Cable Tech Center
Check out the new Samtec Cable Group Tech Center video. It’s an overview of the Samtec Cable Group, our R&D and manufacturing Technology Center focusing on precision extruded micro coax and twinax cable used for high speed / high density cable assemblies, including 26-38 AWG, 50/75/85/100 ohm impedance, and systems rated at 28+ Gbps. Cable Options Samtec Cable Group offers a variety of center conductor, dielectric, shielding, and jacket options. Center conductor options include … [Read more...]