Samtec’s new high speed, high density right angle socket array – SEARAY™ 0.80 mm pitch – is ideal for perpendicular board-to-board and micro backplane applications with up to 50 percent board space savings compared to .050″ (1.27 mm) pitch SEARAY™ interconnects.
The open pin field design allows for maximum grounding and routing flexibility with up to 500 total Edge Rate® contacts.
This ultra high density right angle socket array (SEAF8-RA Series) features:
- a choice of 8 or 10 rows of pins
- up to 50 contacts per row
- high speed performance of 28+ Gbps
- optional guide post holes for blind mating
Also, a mating micro coax cable assembly (ESCA Series) features 34 AWG micro ribbon coax cable, a signal to ground ratio of 4:1 and optional screw downs.
Samtec’s Edge Rate® contact system increases cycle life and minimizes the effects of broadside coupling, which decreases crosstalk for superior signal integrity performance and impedance control. This rugged contact system is also less prone to damage when “zippered” during unmating.
Standard lead-free solder charge terminations simplify IR reflow termination and improve solder joint reliability.
Samtec’s SEARAY™ products are the industry’s largest offering of high speed, high density open pin field arrays. Samtec’s Signal Integrity Group provides application support via its in-house signal integrity engineers for SEARAY™ interconnects and many other products. These highly qualified engineers help with application specific design, modeling and testing as well as interpretation of the test data and performance results, and much more.