Samtec’s new high speed, high density right angle socket array - SEARAY™ 0.80 mm pitch - is ideal for perpendicular board-to-board and micro backplane applications with up to 50 percent board space savings compared to .050" (1.27 mm) pitch SEARAY™ interconnects. The open pin field design allows for maximum grounding and routing flexibility with up to 500 total Edge Rate® contacts. This ultra high density right angle socket array (SEAF8-RA Series) features: a choice of 8 or 10 … [Read more...]
New SEARAY™ High Density Press Fit Right Angle Socket
Samtec’s SEARAY™ high density, high-speed array interconnect is now available in a right angle, press-fit design. SEARAY™ The SEARAY™ high speed array system is a 1.27 mm pitch open pin field array for maximum grounding and routing flexibility. It is available with up to 500 I/Os, and the rugged Edge Rate® contact has low insertion and withdrawal forces to simplify pcb handling. SEARAY® is an Extended Life Product™ (ELP) and has passed 10 year mixed flowing gas (MFG) and high … [Read more...]