Samtec Technology Centers:
- Microelectronics / IC Packaging: Precision die attach, ultra-fine pitch and low profile wire bond, flip chip, underfill, and dam and encapsulation, complete IC-to-board design, and support and manufacturing of IC packaging, substrates, micro high density interposers and micro optical engines. (video)
- Optical Group: Engineering team dedicated to the design, development, and application support of high performance micro optical engines, active optical assemblies, and high density ganged passive optical panel solutions. (video)
- Signal Integrity Group: In-house signal integrity expertise for complex applications, with live EE support available 24/7 worldwide. Advanced design support including Differential Vias™ and routing recommendations using Tri-Planar™ trace technology.
- Teraspeed® Consulting: Signal integrity services team providing complete system design, full channel signal and power integrity analysis and modeling, thermal management, and signal integrity-optimized advanced IC packaging for 28+ Gbps and beyond.
- High Speed Cable Plant: R&D and manufacturing of precision extruded micro coax and twinax cable used for high speed / high density cable assemblies, including 26-38 AWG, 50/75/85/100 ohm impedance, and systems rated at 28+ Gbps. (video)
- Advanced Interconnect Design: High precision stamping, plating, molding, and automated assembly for fine pitch and array interconnects used for board-to-board, interposers, backplane, and high speed/high density cable assemblies. (video)