If you're reading this, chances are you work with board level interconnects and are familiar with design and processing issues that affect them. If your job doesn’t require you to work with connectors, but you’re still reading this, then you are probably messed up and need some type of professional help. Assuming you're in the first group, check out the list below. This is from Phil Eckert, Samtec’s Customer Quality Engineering Manager. Phil’s career includes connector design, quality … [Read more...]
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SEARAY™ Solder Joints Are Class 3, IPC-A-610
Samtec SEARAY™ SEAM, SEAF Series solder joints are now classified as Class 3 in the IPC-A-610 Rev F Standard. Class 3 is for high performance/harsh environment electronic products. This includes products where continual high performance or performance-on-demand is critical, equipment downtime cannot be tolerated, the end-use environment may be extremely harsh, and the equipment must function when required. Common examples include flight controls on an aircraft and life support or other critical … [Read more...]
Samtec Joins IRT Nanoelec Silicon Photonics Program
Samtec is pleased to announce its entrance in the Silicon Photonics Program of the IRT Nanoelec headed by CEA-Leti. Samtec is joining CNRS, STMicroelectronics, Mentor Graphics and CEA-Leti to develop and industrialize optical communications solutions using Silicon Photonics technology for addressing Data Centers and High Performance Computing applications. Officials from all parties expressed their enthusiasm. “We are thrilled with the opportunity to join the Silicon Photonics Program of the … [Read more...]
28 Gbps FireFly Demo With Anritsu MP1800A At OFC
Anritsu Company (OFC booth #1309) and Samtec (OFC booth #1849) are conducting optical transmission technology demonstrations in the Samtec booth during OFC 2015, in Los Angeles, March 24-26. The demonstrations use high quality signals generated from the Anritsu MP1800A BERT Signal Quality Analyzer to highlight the link performance (up to 28 Gbps) of Samtec’s new 12 channel, 28 Gbps FireFly™ Micro Flyover System™. The superior signal integrity up to 32 Gbps of the MP1800A BERT enables Samtec … [Read more...]
DesignCon 2015 Paper Now Available – “Optimizing Symmetry In Open Pin Field Designs
Samtec and Teraspeed Consulting presented several papers at DesignCon 2015. The first is "Optimizing Symmetry In Open Pin Field Designs." This paper presents a process for analyzing open field array structures. Various modes of propagation and coupling within the array of conductors are studied. We find that, counter intuitively, the use of additional ground structures can be detrimental to performance. It is demonstrated that by careful use of symmetry, high signal density can be achieved … [Read more...]
60A Power Socket Now Available With Press Fit Termination
Samtec’s line of PowerStrip™ interconnects includes the EXTreme Ten60Power™ socket and terminal system that delivers high current power performance of up to 60A per power blade (1 blade powered at 75ºC; 30ºC Temperature Rise). These interconnects are available as power only or signal/power combinations for increased design flexibility. Symmetrical or asymmetrical configurations of up to 12 total power blades on 5,50 mm (.217") pitch are available on either side of 24 signal pins on 2,54 mm … [Read more...]
Samtec Demos PCIe Gen 3 Over Fiber At SC14
If you are at SC14 (SuperComputing) in New Orleans, swing by the Samtec booth (#956) and check out our two demos. One of them demonstrates remote PCI Express® (PCIe®) Gen 3 switching over fiber. The system demonstrated achieves x8 PCIe® Gen 3 data rates (8 GT/s, 64 Gb/s aggregate) to transmit 4k UHD video 100 meters upstream from a PCIe® SSD to a server and back downstream to a GPU linked to a 4k display. The demonstration uses Samtec’s unique PCIEO Series Active Optical cable assembly based … [Read more...]
0,80 mm Pitch Discrete Wire System Offers High Reliability with Space Savings
Samtec recently expanded its line of Tiger Eye™ products with a 0,80 mm pitch discrete wire system ideal for rugged applications where a highly reliable connection must be maintained. The micro pitch system increases contact density for greater space savings and features Samtec’s Tiger Eye™ contacts, which are designed for high reliability and high mating cycles. The Tiger Eye™ discrete wire socket cable assembly (SESDT Series) is available in a double row design with up to 40 total positions … [Read more...]
Julian Ferry Interview On High Speed Interconnect Design Developments
Julian Ferry, Samtec’s High Speed R&D Manager, recently spoke to Connector Supplier about the latest developments in high speed interconnects, the applications driving them, and how Samtec is meeting the challenges. Here is a full copy of the interview, courtesy of Connector Supplier. Q&A: Samtec on Signal Integrity. By Patricia Staino, June 16, 2014 Recently we spoke to Julian Ferry, high-speed R&D manager at Samtec, to learn more about the latest developments in high-speed … [Read more...]
Micro Flyover Cable System Allows Future-Proof Designs
Samtec's FireFly™ Micro Flyover System is an inside-the-box interconnect system that gives designers the option to future-proof their systems. This future proofing allows an easy upgrade from copper to optical with the same connector and footprint. With the highest 14 Gbps bandwidth density available, the FireFly™ system enables chip-to-chip, board-to-board and system-to-system connectivity at data rates up to 28Gb/s (in development). By taking the data connections “off-board” with flyover … [Read more...]