A Look Inside Samtec’s High Speed Cable Tech Center
Check out the new Samtec Cable Group Tech Center video.
It’s an overview of the Samtec Cable Group, our R&D and manufacturing Technology Center focusing on precision extruded micro coax and twinax cable used for high speed / high density cable assemblies, including 26-38 AWG, 50/75/85/100 ohm impedance, and systems rated at 28+ Gbps.
Cable Options
Samtec Cable Group offers a variety of center conductor, dielectric, shielding, and jacket options.
Center conductor options include solid, stranded, tin-plated copper, silver-plated copper, and high-strength alloy, from 23 AWG to 38 AWG. Dielectric options include solid (FEP, LDPE) and foam (coax only, FEP).
Shielding options include serve (spiral), tape, and braid. Jacket options, all RoHS compliant, including FEP, PVC, THV, and TPU.
Next Generation Products
The Samtec Cable Group is aggressively pursuing next generation micro-coax and twinax products to solve our customer’s existing and future signal integrity challenges.
Among others, this includes ultra-low skew twinax, extreme density twinax, high frequency microwave coax cable with world class phase stability, and halogen free material choices. We are enabled by our internally developed, proprietary processes including micro cellular dielectric extrusion, co-extruded twin-ax, and state of the art closed loop process controls.
Samtec Technology Centers
Advanced Interconnect Design: High precision stamping, plating, molding, and automated assembly for fine pitch and array interconnects used for board-to-board, interposers, backplane, and high speed/high density cable assemblies.
High Speed Cable Plant: R&D and manufacturing of precision extruded micro coax and twinax cable used for high speed / high density cable assemblies, including 26-38 AWG, 50/75/85/100 ohm impedance, and systems rated at 28+ Gbps.
Microelectronics / IC Packaging: Precision die attach, ultra-fine pitch and low profile wire bond, flip chip, underfill, and dam and encapsulation, complete IC-to-board design, and support and manufacturing of IC packaging, substrates, micro high density interposers and micro optical engines.
Optical Group: Engineering team dedicated to the design, development, and application support of high performance micro optical engines, active optical assemblies, and high density ganged passive optical panel solutions.
Signal Integrity Group: In-house signal integrity expertise for complex applications, with live EE support available 24/7 worldwide. Advanced design support including Differential Vias™ and routing recommendations using Tri-Planar™ trace technology.
Teraspeed® Consulting: Signal integrity services team providing complete system design, full channel signal and power integrity analysis and modeling, thermal management, and signal integrity-optimized advanced IC packaging for 28+ Gbps and beyond.
Other links that may be of interest:
- Strike Up The Bandwidth Beyond 28 Gbps
- Rugged, Dense, and Fast: This Is A New Cable Assembly, Not Your Daughter’s Boyfriend
- PCIe Gen 3 Protocol Over Fiber
- Direct Connect High Speed Press Fit Cable Assembly
- Samtec 12 Channel, 28 G FireFly Demo – An Interview With Kevin Burt
- Samtec High Speed Cable Assemblies
