Samtec, Inc., and Teraspeed® Consulting are presenting five technical papers, giving two physical high speed product demonstrations, and showcasing several new products at DesignCon 2015. Samtec’s new location is booth #943, and Teraspeed® Consulting is booth #1048. Samtec’s presentations are: Optimizing Symmetry in Open Pin Field Designs – Wednesday, January 28 – 2:50pm – 3:30pmCausality Demystified – Thursday, January 29 – 8:30am – 9:10am Teraspeed® Consulting’s presentations … [Read more...]
Samtec Demos PCIe Gen 3 Over Fiber At SC14
If you are at SC14 (SuperComputing) in New Orleans, swing by the Samtec booth (#956) and check out our two demos. One of them demonstrates remote PCI Express® (PCIe®) Gen 3 switching over fiber. The system demonstrated achieves x8 PCIe® Gen 3 data rates (8 GT/s, 64 Gb/s aggregate) to transmit 4k UHD video 100 meters upstream from a PCIe® SSD to a server and back downstream to a GPU linked to a 4k display. The demonstration uses Samtec’s unique PCIEO Series Active Optical cable assembly based … [Read more...]
12G SDI FPGA Mezzanine Card Targeting Xilinx Platforms
Fidus Electronic Development and inrevium has introduced the TB-FMCH-12GSDI, a 6G/12G SDI FPGA Mezzanine Card (FMC) targeting Xilinx platforms. Fidus uses six, 75 ohm Samtec HDBNC connectors, as well as SEARAY™ interconnect systems as specified in the VITA 57 standard. The six HDBNC connectors support: 1x 12G SDI input, 1x 12G SDI output, 3x 12G In or Out, and 1x Video Sync input. With onboard Sync separator and Clock Generator, the FMC can provide all necessary inputs to the FPGA. The FMC is … [Read more...]
Samtec, FCI Sign Second Source Pact For ExaMAX
Samtec and FCI announced the signing of a second-source agreement for Samtec to manufacture, market and sell FCI’s ExaMAX® high speed backplane system. We will keep you posted as more details become available. View The Full Press Release PDF Click here for a product overview: http://samtec.com/examax … [Read more...]
Julian Ferry Interview On High Speed Interconnect Design Developments
Julian Ferry, Samtec’s High Speed R&D Manager, recently spoke to Connector Supplier about the latest developments in high speed interconnects, the applications driving them, and how Samtec is meeting the challenges. Here is a full copy of the interview, courtesy of Connector Supplier. Q&A: Samtec on Signal Integrity. By Patricia Staino, June 16, 2014 Recently we spoke to Julian Ferry, high-speed R&D manager at Samtec, to learn more about the latest developments in high-speed … [Read more...]
High Density SEARAY™ .8 Saves 50% Board Space
Samtec's ultra high density open pin field arrays, created on an 0,80 mm pitch can save you up to 50% board space compared to standard 1,27 mm pitch grid arrays. High density socket arrays, our SEAF8 Series, and terminal arrays, our SEAM8 Series, come standard with patented rugged Edge Rate™ contacts, which are less prone to damage when “zippered” to unmate. SEARAY™ .8 is currently available up to 300 I/Os Two new options include an 8 row and a 10 row design which allow up to 500 I/Os. … [Read more...]
Micro Flyover Cable System Allows Future-Proof Designs
Samtec's FireFly™ Micro Flyover System is an inside-the-box interconnect system that gives designers the option to future-proof their systems. This future proofing allows an easy upgrade from copper to optical with the same connector and footprint. With the highest 14 Gbps bandwidth density available, the FireFly™ system enables chip-to-chip, board-to-board and system-to-system connectivity at data rates up to 28Gb/s (in development). By taking the data connections “off-board” with flyover … [Read more...]
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