Samtec has a long history of developing mezzanine interconnect solutions that meet and exceed our customer’s expectations. Our legacy revolves around standard board-to-board connectors used in applications ranging from TV remotes to MRI machines. Our depth of solutions has grown as time has passed, but one family of products offers the density, performance and flexibility to support many high-speed board-to-board applications. SEARAY™ High-Density Open Pin Field Array's many features and … [Read more...]
FireFly™ Finds a Home in PCIe Expansion Cards
PCI Express continues to grow as the de facto I/O expansion bus in a number of embedded computing applications. The flexibility of the PCIe interface and the data rates it supports have spawned a number of standard PCB form factors adopted in many different applications. A common functionality added to many PCIe form factor expansion cards is optical networking. While industry standard active optical cables target typical datacom and telecom applications, a variety of high-speed I/O … [Read more...]
Gaining an Edge in PCB Design: The Evolution of the Edge Card
1944. America was in the heat of World War II and continually seeking new and more advanced options against her enemies. One such device was the proximity sensor used to disable and destroy enemy aircraft from a distance. However, a significant problem arose; the electrical signal had to be small yet rugged enough to be able to be placed inside and fired from a gun to enable the sensor from miles away. This engineering challenge sparked the development of microelectronics and PCBs. Over … [Read more...]
A Friend Features FireFly™ Micro Flyover System™
Where do engineers turn when they need unbiased, truthful and updated information to solve their problem of the day? An internet search? Social media? A video? While those are all popular and have their merits, engineers often trust friends and colleagues the latest technology trends. One of Samtec's "friends" is Avnet Abacus , one of our pan-European distributors. The highly specialized technologists at Avnet Abacus consistently provide technical insight into the markets and … [Read more...]
Samtec Expert to Present at SEMICON West
Steve Groothuis, CTO of Samtec Microelectronics, in one of many panelists presenting at the Advanced Packaging Forum during SEMICON West next week at the Moscone Center in San Francisco, CA. The Advanced Packaging Forum gathers executives, university researchers, engineers, R+D personnel, program managers and other technology experts across the IC packaging and assembly industry. Attendees you will learn about some of the latest assembly and packaging technologies—wafer-level … [Read more...]
Come Fly With Me
Traveling to a far-away destination usually involves a choice: do I drive or do I fly? Driving entails a slower pace and traffic while flying allows a direct connection to your final destination for around the same price. This simple analogy illustrates choices electronics designers face in getting data from point A to point B. Technology advancement drives added functionality in many of today’s popular applications. OEMs are responding by adding computing and processing power via advanced … [Read more...]
Samtec Expands Support of PCI/104-Express™ Systems
In the mobile world we live in, many view products based on the X86 microprocessor architecture as technology from a bygone era. However, X86 solutions abound in many everyday applications from our desktop and laptop computers to the servers and network solutions found in modern data centers. Another area where X86 solutions abound is embedded computing applications. More than 20 years ago, the computing industry established a common vision of adapting desktop computer technology for … [Read more...]
Samtec Launches Silicon-to-Silicon™ System Optimization Microsite
Increasing data rates, denser systems and shrinking product footprints challenge designers to meet their system signal integrity needs. Samtec’s Silicon-to-Silicon™ System Optimization capabilities provide engineers the service, products, tools and resources to optimize the entire signal chain of a system, from bare die to IC package and assembly, to PCB, to connectors and cable assemblies, and back again. Gaining access to all of these capabilities can be daunting for those not familiar … [Read more...]
Xilinx and Samtec Deepen Technical Collaboration
Higher data rates in today’s bleeding edge ICs require constant innovation in interconnect to route signals on PCBS and between them. Samtec’s Silicon to Silicon System Optimization provides engineers the service, products, tools and resources to optimize the entire signal path from bare die to IC package and assembly to PCB to connectors and cable assemblies and back again. A practical case study in our Silicon to Silicon System Optimization capabilities is leading FPGA vendor Xilinx. … [Read more...]
Eric Bogatin’s Three Predictions On The State Of Signal Integrity
Signal Integrity expert Eric Bogatin recently shared three predictions on the state of signal integrity. Based on his discussions at DesignCon 2016 and thereafter, Eric has three predictions about major changes ahead for high speed serial link systems. The first is the rollout of 28 Gbps systems will be slower than expected. Eric explains that the semiconductor companies producing the CMOS devices – ASIC, FPGA or custom – are doing fine producing the silicon with acceptable performance at 28 … [Read more...]