Samtec proudly announces the release of a high-speed board-to-board connector family compliant to the ANSI/VITA 57.4-2016 standard. Samtec’s family of FMC+ connectors helps support the expanded interface and faster speeds of the latest FMC+ applications. The new ANSI/VITA 57.4-2016 standard extends the capabilities of ANSI/VITA 57.1-2010 in support of the increased number and data rates of multi-gigabit interfaces found in advanced FPGA architectures. Highlights of the new standard … [Read more...]
New ETUO Series Extends FireFly™ Temperature Range
Samtec's FireFly™ Micro Flyover System™ continues to gain industry acceptance in mid-board copper and optical cable assembly systems. The ECUO series can be found in a number of applications requiring standard temperature ranges. The popularity of ECUO has established a need for an extended temperature version of the FireFly™ Active Optical Cable Assemblies. In response, Samtec recently released the ETUO series. Key ETUO Features The ETUO series shares the core … [Read more...]
Samtec Helps with IIoT Security
Is seems hardly a day passes without "secure" data being hacked. Whether personal photos, enterprise data or factory floor controls, data security has become a higher focus for many. Avnet's new Trusted Platform Module (TPM) Security Peripheral Module for Zynq®-7000 All Programmable SoCs enables a root of trust for platform integrity, remote attestation, and cryptographic services required for IIoT applications. This new solution supports additional use cases such as … [Read more...]
Samtec FireFly™ PCIe® Optical Flyover Cable Assembly Fully Supports PCIe 4.0
PCIe 4.0 is just around the corner in 2017, at least according to the leading computer processor vendors. In recent months, both Intel and AMD have hinted at plans for PCIe 4.0 in future platforms. This promotes the advantages of the new standard with hopes of a wider range of applications. Here is a quick review of some of PCIe 4.0 advantages: Double the bandwidth over PCIe 3.0 from 8 GTps to 16 GTpsEnhanced power efficiencyFull backwards compatibility with previous … [Read more...]
Samtec Releases “SI? Why do I Care” ChalkTalk
Samtec is pleased to announce a new ChalkTalk entitled “SI? Why do I Care?.” Hosted by EEJournal, this newly released ChalkTalk details SI basics and how they affect connector selection. SI not just for "Experts” Most designs these days have high-speed interfaces that require a solid strategy for SI. This calls for understanding the "basics" of SI. The ChalkTalk defines each of the following terms and how it relates to connector selection and simulation. Insertion Loss … [Read more...]
More Samtec Updates from electronica 2016
Thursday is another day in the books here at electronica 2016. The Samtec booth continues to see high traffic from customers, vendors, partners and distributors. What is generating the most interest today? See below: High-Speed Edge Card Systems Designers and engineers here at electronica 2016 have a high degree of trust in tried-and-true interconnect solutions. Samtec's High-Speed Edge Card Systems offer several options providing flexibility in system design. Some key features … [Read more...]
Samtec Updates from electronica 2016
Electronica 2016 continues on Wednesday, November 9, 2016. The Samtec booth has been busy, and all of the exchanges with customers and partners are positive. What key areas are customers interested in? See below. Glass Core Technology Many visitors at Electronica are learning how Glass Core Technology can improve functionality in a much smaller footprint when compared to traditional packaging substrates. For more information on GCT, please download Samtec's Microelectronics … [Read more...]
Updates from electronica 2016
Electronica 2016 continues to unfurl this week in Munich. This year's show looks busier than ever! As we noted in our blog last week, Samtec is prominently featured at the event this year. If you are in Munich, please stop by Hall B3 Booth 407 to see the new technologies and products we are displaying this year. Glass Core Technology: Glass Core Technology (GCT) can achieve maximum functionality in a significantly smaller footprint with glass-based IC packages, modules, … [Read more...]
Samtec’s Glass Core Technology Featured at IMAPS 2016
IMAPS - International Microelectronics Assembly and Packaging Society - in one of the biggest events of the year in the IC Package and Assembly industry. Last week at IMAPS 2016, Samtec Microelectronics highlighted our world-class complex package and assembly capabilities and our emerging Glass Core Technology (GCT). Samtec's IC package and assembly capabilities include precision die attach, ultra-fine pitch wire bonding, expertise in packaging and substrate design, stacked … [Read more...]
Avnet Zynq Transceiver Evaluation Kit Features Samtec RF Cable Assemblies
Engineers constantly face challenges routing multi-gigabit transceivers (MGTs) throughout their systems. The new Avnet Zynq Transceiver Evaluation Kit (AZTEK) provides a low-cost reference design that streamlines evaluation of FPGA SoC MGTs that require transmission of large amounts of data at high communication rates or over long distances. The AZTEK kit uses Samtec’s SMA RF316 cable assemblies that reliably route high data rate signals in industrial, consumer, medical and … [Read more...]
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