Steve Groothuis, CTO of Samtec Microelectronics, in one of many panelists presenting at the Advanced Packaging Forum during SEMICON West next week at the Moscone Center in San Francisco, CA. The Advanced Packaging Forum gathers executives, university researchers, engineers, R+D personnel, program managers and other technology experts across the IC packaging and assembly industry. Attendees you will learn about some of the latest assembly and packaging technologies—wafer-level … [Read more...]
NXP SCM Demo Features Samtec Interconnect
Increased functionality in everyday devices continues to drive the innovation in the electronics industry. From the growth in camera drones to smart glasses and robots, consumers today demand more of the purchases they make. Traditional electronic designs are multi-chip solution featuring microprocessors, memory, power, IO and other essential system functionality. Design cycles last from months to years depending on complexity. Legacy design approaches prove inefficient for … [Read more...]
Samtec Expands Support of PCI/104-Express™ Systems
In the mobile world we live in, many view products based on the X86 microprocessor architecture as technology from a bygone era. However, X86 solutions abound in many everyday applications from our desktop and laptop computers to the servers and network solutions found in modern data centers. Another area where X86 solutions abound is embedded computing applications. More than 20 years ago, the computing industry established a common vision of adapting desktop computer technology for … [Read more...]
Samtec Launches Silicon-to-Silicon™ System Optimization Microsite
Increasing data rates, denser systems and shrinking product footprints challenge designers to meet their system signal integrity needs. Samtec’s Silicon-to-Silicon™ System Optimization capabilities provide engineers the service, products, tools and resources to optimize the entire signal chain of a system, from bare die to IC package and assembly, to PCB, to connectors and cable assemblies, and back again. Gaining access to all of these capabilities can be daunting for those not familiar … [Read more...]
Xilinx and Samtec Deepen Technical Collaboration
Higher data rates in today’s bleeding edge ICs require constant innovation in interconnect to route signals on PCBS and between them. Samtec’s Silicon to Silicon System Optimization provides engineers the service, products, tools and resources to optimize the entire signal path from bare die to IC package and assembly to PCB to connectors and cable assemblies and back again. A practical case study in our Silicon to Silicon System Optimization capabilities is leading FPGA vendor Xilinx. … [Read more...]
Samtec Releases Micro Discrete Wire Application Design Guide
Wire-to-board connectors have been around for decades. They evolved as a solution for easier manufacturing in modern electronics versus legacy terminations such as soldering wires directly to the board. Standard .100” (2.54mm) pitch wire-to-board socket and headers can be found in many industrial and transportation applications for both signaling and power. The PC revolution on the 1980s and 1990s pioneered IDC systems linking hard drives, power suppliers and other I/O devices … [Read more...]
Avnet Industrial IoT Starter Kit Includes Samtec
No matter where we look the amount of devices connected to the Internet continues to grow. It seems but only a few years ago that a PC with a dial-up 56 kbps modem was bleeding edge. Households with internet connectivity measured in the millions. According to one source, only 1% of the world’s population had Internet connectivity in 1995. Obviously, times haves changed with smart phones, wearable fitness devices, media players and other commonplace Internet-connected consumer … [Read more...]
Samtec Releases Twinax Flyover Application Design Guide
The march to faster data rates never seems to stop. Communications protocols used in the data center provide the proof. Fiber Channel signals can run up to 32 Gbps. 25G Ethernet 802.3bj and Ethernet 100G signals can run up to 25Gbps. InfiniBand EDR 104G serial channels support 26 Gbps data rates. This presents engineers of high-speed serial channels with a number of PCB design challenges. Some of the key limitations of PCBs running at 28+ Gbps include trace … [Read more...]
Samtec Updates Broadcast Video Solution Guide
Streaming HD video and 4K/8K UHDTV are just two examples of a continuing evolution in video signaling. Video has transformed from being an analog 6 MHz bandwidth signal to a 12 Gbps digital data stream. As signaling has transitioned into the digital domain, first in SD and HD formats, and recently at 6 Gbps and 12 Gbps 4K UHD-SDI standards, the demand for meeting stringent return loss requirements up to 12 GHz has emerged. Samtec offers a full line of high-speed board-to-board and RF … [Read more...]
Samtec Exhibits at 2016 NAB Show in Las Vegas
One of the biggest tradeshows in entertainment and media is NAB Show. It is the world’s largest annual conference and expo for professionals who create, manage, and distribute entertainment across all platforms At this year’s event in Las Vegas, Samtec will feature a variety of interconnect solutions targeted at the broadcast video market. These include mid-board and panel mount optical systems based on FireFly™ , True75TM 75Ω RF Systems, full turnkey RF cable assemblies, and … [Read more...]