Samtec has a long history of developing mezzanine interconnect solutions that meet and exceed our customer’s expectations. Our legacy revolves around standard board-to-board connectors used in applications ranging from TV remotes to MRI machines. Our depth of solutions has grown as time has passed, but one family of products offers the density, performance and flexibility to support many high-speed board-to-board applications. SEARAY™ High-Density Open Pin Field Array's many features and … [Read more...]
FireFly™ Finds a Home in PCIe Expansion Cards
PCI Express continues to grow as the de facto I/O expansion bus in a number of embedded computing applications. The flexibility of the PCIe interface and the data rates it supports have spawned a number of standard PCB form factors adopted in many different applications. A common functionality added to many PCIe form factor expansion cards is optical networking. While industry standard active optical cables target typical datacom and telecom applications, a variety of high-speed I/O … [Read more...]
A Friend Features FireFly™ Micro Flyover System™
Where do engineers turn when they need unbiased, truthful and updated information to solve their problem of the day? An internet search? Social media? A video? While those are all popular and have their merits, engineers often trust friends and colleagues the latest technology trends. One of Samtec's "friends" is Avnet Abacus , one of our pan-European distributors. The highly specialized technologists at Avnet Abacus consistently provide technical insight into the markets and … [Read more...]
Samtec Enables IoT Connectivity in Avnet’s AT&T Cellular IoT Starter Kit
Consumers often take for granted the constant connectivity 4G LTE provides as they travel to remote locations. Social media outages, lack of instant video updates or no e-mail access are afterthoughts. If any of these ever happened, life as we know it would be over! The end of life may be a slight exaggeration, but our ubiquitous access to Internet connectivity illustrates how integrated into daily lives it has become. Industrial Wireless Connectivity The industrial market … [Read more...]
Samtec Expert to Present at SEMICON West
Steve Groothuis, CTO of Samtec Microelectronics, in one of many panelists presenting at the Advanced Packaging Forum during SEMICON West next week at the Moscone Center in San Francisco, CA. The Advanced Packaging Forum gathers executives, university researchers, engineers, R+D personnel, program managers and other technology experts across the IC packaging and assembly industry. Attendees you will learn about some of the latest assembly and packaging technologies—wafer-level … [Read more...]
NXP SCM Demo Features Samtec Interconnect
Increased functionality in everyday devices continues to drive the innovation in the electronics industry. From the growth in camera drones to smart glasses and robots, consumers today demand more of the purchases they make. Traditional electronic designs are multi-chip solution featuring microprocessors, memory, power, IO and other essential system functionality. Design cycles last from months to years depending on complexity. Legacy design approaches prove inefficient for … [Read more...]
Samtec Expands Support of PCI/104-Express™ Systems
In the mobile world we live in, many view products based on the X86 microprocessor architecture as technology from a bygone era. However, X86 solutions abound in many everyday applications from our desktop and laptop computers to the servers and network solutions found in modern data centers. Another area where X86 solutions abound is embedded computing applications. More than 20 years ago, the computing industry established a common vision of adapting desktop computer technology for … [Read more...]
Samtec Launches Silicon-to-Silicon™ System Optimization Microsite
Increasing data rates, denser systems and shrinking product footprints challenge designers to meet their system signal integrity needs. Samtec’s Silicon-to-Silicon™ System Optimization capabilities provide engineers the service, products, tools and resources to optimize the entire signal chain of a system, from bare die to IC package and assembly, to PCB, to connectors and cable assemblies, and back again. Gaining access to all of these capabilities can be daunting for those not familiar … [Read more...]
Xilinx and Samtec Deepen Technical Collaboration
Higher data rates in today’s bleeding edge ICs require constant innovation in interconnect to route signals on PCBS and between them. Samtec’s Silicon to Silicon System Optimization provides engineers the service, products, tools and resources to optimize the entire signal path from bare die to IC package and assembly to PCB to connectors and cable assemblies and back again. A practical case study in our Silicon to Silicon System Optimization capabilities is leading FPGA vendor Xilinx. … [Read more...]
Samtec Releases Micro Discrete Wire Application Design Guide
Wire-to-board connectors have been around for decades. They evolved as a solution for easier manufacturing in modern electronics versus legacy terminations such as soldering wires directly to the board. Standard .100” (2.54mm) pitch wire-to-board socket and headers can be found in many industrial and transportation applications for both signaling and power. The PC revolution on the 1980s and 1990s pioneered IDC systems linking hard drives, power suppliers and other I/O devices … [Read more...]