Increased functionality in everyday devices continues to drive the innovation in the electronics industry. From the growth in camera drones to smart glasses and robots, consumers today demand more of the purchases they make.
Traditional electronic designs are multi-chip solution featuring microprocessors, memory, power, IO and other essential system functionality. Design cycles last from months to years depending on complexity.
Legacy design approaches prove inefficient for electronics OEMs developing new products in anticipation for consumer’s latest whims. Design simplification and size reduction must be accomplished via other means
NXP has recently introduced their line of Single-Chip System Modules (SCM). These are a disruptive new technology that provides an extremely high level of integration in a tiny form-factor. They include applications processors, power management devices, memory (flash and DDR) and passive components in a single PoP configuration. NXP also provides necessary reference designs and software for immediate system bring-up.
SCM devices are proven to significantly simplify your design, miniaturize your form factor and accelerate your product development. They eliminate high-speed memory design and simplify the design complexity of the CPU/PMIC/memory interface.
NXP developed a demonstration platform for their first SCMs for an industry tradeshow. The demonstration highlight the power of their SCMs by running a dual LCD display and a forward facing camera for heads up display information in KIOSK applications. Watch this video for more details:
This demo leverages some key interconnect solutions from Samtec. The SCM board and the system I/O board feature Samtec’s 0.50mm Q Strip® High-Speed Ground Plane Socket Strips (QSH Series) and Q Strip® High-Speed Ground Plane Terminal Strips (QTH Series).
Samtec Q Strip® connectors are designed for high-speed board-to-board applications where signal integrity is essential. They feature integral ground planes, rugged Edge Rate® contacts, slim body and low profile stack heights.
The NXP demo links the two boards together using Samtec’s 0.50 mm Q Strip® High-Speed Coax Cable Assembly (HQCD series). These cable assemblies feature
For more information on these Samtec interconnect solutions, please download the following resources: