Samtec distributor partner Avnet recently released its new UltraZed-EV Starter Kit targeted at embedded vision applications. Comprised of the UltraZed-EV SoM and the UltraZed-EV Carrier Card, this kit offers engineers and designers a complete platform for prototyping and evaluating embedded video processing systems. The Avnet development team worked with Samtec to identify SEARAY™ 0.80 mm Pitch Ultra High-Density Arrays as the mezzanine connector between the SoM and Carrier Card. The … [Read more...]
Guidelines For Processing Micro Pitch Edge Card Connectors
Processing Micro Pitch Edge Card Connectors Processing micro pitch edge card connectors is easy, just like playing first base. Of course we know that's a lie -- manufacturing challenges increase as connector pitches decrease. Samtec recently released a 0.50 mm pitch edge card socket. The new MEC5 series (in vertical and right angle designs) is the industry’s first .5 mm pitch edge card socket with a justification beam. This socket meets the demands for higher density and bandwidth, … [Read more...]
Extreme Density, Micro Edge Card Socket for Cost Optimization
Samtec has released the industry’s first 0.50 mm pitch edge card socket with justification beam. This design allows high-speed signals to pass through an incredibly dense connector while keeping the mating PCB at a reasonable cost. The socket’s justification beam is designed to shift the card into proper alignment with the contacts. This allows for standard board tolerance on cards that typically would not work with ultra-fine pitch connectors. Manufacturing costs are then optimized … [Read more...]
56/112 Gbps PAM4 Modular System Architecture With Samtec Flyover
Modular System Architecture Traditional communication and switch architecture leverages integrated designs in a single high-speed PCB, but this architecture is beginning to face signal integrity and thermal challenges at 56 and 112 Gbps PAM4. Samtec Flyover™ QSFP-DD solutions offer improved signal integrity and enable new modular system architectures, which also improve thermal efficiencies and lower costs. These next generation modular system architectures also enable greater design … [Read more...]
Samtec Exhibits Technical Breadth at Embedded World 2018
One of the largest events in the embedded electronics industry - Embedded World 2018 - occurs from Nuremberg this week. More than 1,000 exhibitors, including Samtec, will showcase new products and innovations across the spectrum of the embedded applications. Samtec will exhibit its growing technical breadth at Embedded World 2018 in Hall 4A, Stand 4A-240. New high-speed board-to-board connectors ideally suited for embedded systems will be highlighted. Samtec's microelectronic … [Read more...]
Analog Devices Expands the FMC and FMC+ Ecosystem
Regular readers of the Samtec blog are keenly aware of VITA 57 FMC and FMC+ solutions Samtec offers. For more than 10 years, this standard has defined the interface between FPGAs and various expansion modules in a growing number of applications. As FMC/FMC+ leverages open platforms and standards, developers are working to further the adaptation of FPGA technologies in applications ranging from datacom/telecom and broadcast video to instrumentation, aerospace and defense. More and more … [Read more...]
Samtec New Products At DesignCon 2018
Samtec will be introducing several new products at DesignCon 2018. All of these products are designed to increase data rates, increase system density, and shrink product footprints, so designers can meet their system signal integrity needs. NovaRay™ High Bandwidth, High Density Array Samtec’s NovaRay™ is an industry-leading high bandwidth, high-density interconnect system. The pin-to-ground differential pair configuration enables very low crosstalk to 40 GHz+, tight impedance … [Read more...]
VITA 57 Solutions Enable Scalable ASIC Development Platforms
Readers of the Samtec blog know that FPGAs offer the most flexible electronics development platform in the world. Diverse applications ranging from machine learning and embedded vision to 5G wireless and cloud computing leverage the configurability and programmability of FPGAs to scale I/O, computing and DSP functionality. FPGAs are also frequently used in next-generation ASIC development projects. FPGAs allow for fast and accurate ASIC modeling and verification with accelerated … [Read more...]
28 Gbps Connector Demonstration
The 28 Gbps Product Demonstrator is an active system that showcases a variety of Samtec interconnect products at 28 Gbps and beyond. The Demonstrator was up and running at SC17, and Anthony Fellbaum was there also, where he walked us through the demo. Real World 28 Gbps This demonstration is different from those of other connector suppliers. Many of those demonstrations preferentially showcase one or two differential pairs in a channel through one connector or cable assembly. The 28 … [Read more...]
Samtec Introduces New VITA 57.4-compliant FMC+ Loopback Cards
Developing high-speed communication paths using the latest FPGA multi-gigabit transceivers presents engineers with many challenges. What data rates and protocols need supporting? What reference clock frequency is needed? Will the PLLs work? Thankfully, most of the transceiver hardware concerns - differential signaling, impedance matching, equalization and pre-emphasis among other details - are addressed in FPGA development and evaluation cards from the FPGA vendors. FPGA designers can … [Read more...]
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