Samtec distributor partner Avnet recently released its new UltraZed-EV Starter Kit targeted at embedded vision applications. Comprised of the UltraZed-EV SoM and the UltraZed-EV Carrier Card, this kit offers engineers and designers a complete platform for prototyping and evaluating embedded video processing systems.
The Avnet development team worked with Samtec to identify SEARAY™ 0.80 mm Pitch Ultra High-Density Arrays as the mezzanine connector between the SoM and Carrier Card. The combination of high-performance and high-density of the SEARAY 0.8 mm arrays made it the ideal connector solution for the UltraZed-EV Starter Kit.
The UltraZed-EV SoM features three SEAM8 series terminals. There are two 200-pin terminals in the 50×4 configuration (P/N: SEAM8-50-S02.0-S-04-2-K) and one 120-pin terminal in the 30×4 configuration (P/N: SEAM8-30-S02.0-S-04-2-K).
These Micro Headers provide access from the SoM to the Carrier Card for the various system I/O. This includes support for LVDS touch panel interface, SFP+ interface, HDMI In/Out and other key system components.
UltraZed-EV Carrier Card
The UltraZed-EV Carrier Card features three mating SEAF8 series sockets. There are two 200-pin terminals in the 50×4 configuration (P/N: SEAF8-50-05.0-S-04-2-K) and one 120-pin terminal in the 30×4 configuration (P/N: SEAF8-30-05.0-S-04-2-K).
Additionally, the Carrier Card also provided access to other differentiated solution from Samtec. 3G-SDI access can be gained via three Samtec BNC-style connectors. Further expansion is also enabled via the standard FMC HPC socket and a PCIE series connectors.
SEARAY™ 0.80 mm Pitch Ultra High-Density Arrays
These ultra high-density, high-speed open pin field arrays feature a 0.80 mm pitch grid for up to 50% board space savings compared to .050″ pitch SEARAY™ interconnects. With up to 500 total Edge Rate® contacts optimized for signal integrity, this system allows for maximum grounding and routing flexibility.
The socket is also available in right angle for micro backplane applications with optional guideposts for blind mating. Individual power modules with press fit tails provide a high power option for greater system flexibility.
Other key features of the SEARAY™ 0.80 mm Pitch Ultra High-Density Arrays include:
- Rugged Edge Rate® contact system
- 7 mm and 10 mm stack heights
- Solder charge terminations for ease of processing
- Samtec 28+ Gbps Solution
For more information on the SEARAY™ 0.80 mm Pitch Ultra High-Density Arrays, please visit the SEARAY™ 0.80 mm family page or download the High-Speed Board-to-Board Application Design Guide. Immediate technical support is available from Samtec’s applications experts at SEARAY@samtec.com.