UltraZed-EV SoMThe UltraZed-EV SoM features three SEAM8 series terminals. There are two 200-pin terminals in the 50×4 configuration (P/N: SEAM8-50-S02.0-S-04-2-K) and one 120-pin terminal in the 30×4 configuration (P/N: SEAM8-30-S02.0-S-04-2-K). These Micro Headers provide access from the SoM to the Carrier Card for the various system I/O. This includes support for LVDS touch panel interface, SFP+ interface, HDMI In/Out and other key system components.
UltraZed-EV Carrier CardThe UltraZed-EV Carrier Card features three mating SEAF8 series sockets. There are two 200-pin terminals in the 50×4 configuration (P/N: SEAF8-50-05.0-S-04-2-K) and one 120-pin terminal in the 30×4 configuration (P/N: SEAF8-30-05.0-S-04-2-K). Additionally, the Carrier Card also provided access to other differentiated solution from Samtec. 3G-SDI access can be gained via three Samtec BNC-style connectors. Further expansion is also enabled via the standard FMC HPC socket and a PCIE series connectors.
SEARAY™ 0.80 mm Pitch Ultra High-Density ArraysThese ultra high-density, high-speed open pin field arrays feature a 0.80 mm pitch grid for up to 50% board space savings compared to .050″ pitch SEARAY™ interconnects. With up to 500 total Edge Rate® contacts optimized for signal integrity, this system allows for maximum grounding and routing flexibility. The socket is also available in right angle for micro backplane applications with optional guideposts for blind mating. Individual power modules with press fit tails provide a high power option for greater system flexibility. Other key features of the SEARAY™ 0.80 mm Pitch Ultra High-Density Arrays include:
- Rugged Edge Rate® contact system
- 7 mm and 10 mm stack heights
- Solder charge terminations for ease of processing
- Samtec 28+ Gbps Solution