Samtec will be introducing several new products at DesignCon 2018. All of these products are designed to increase data rates, increase system density, and shrink product footprints, so designers can meet their system signal integrity needs.
NovaRay™ High Bandwidth, High Density Array
Samtec’s NovaRay™ is an industry-leading high bandwidth, high-density interconnect system. The pin-to-ground differential pair configuration enables very low crosstalk to 40 GHz+, tight impedance control, and minimal variance in data rate as stack heights increase. The system is 112 PAM4 capable and is rated up to 56 Gbps NRZ per channel. It boasts an industry-leading aggregate average data rate of 1.33 Tbps per square inch. This extreme performance and density is critical as system sizes decrease while speeds increase.
Two highly reliable points of contact contribute to the 112 Gbps PAM4 capabilities, and ensure a more reliable connection, with stub-free mating.
The 92 ohm impedance rating addresses both 85 and 100 ohm applications. An improved breakout region has been developed using a new offset signal-to-ground configuration. NovaRay is initially available in a variety of configurations from 8 to 72 pairs, and can easily be expanded to higher pair counts because of its modular design. Board-to-board configurations include 8 pairs / 448 Gbps aggregate, 16 pairs / 896 Gbps aggregate, and 32 pairs / 1.8 Tbps aggregate.
Stack heights range from 7 mm to 20 mm. Right angle and vertical cable options are in development, which will combine NovaRay with Samtec’s industry-leading Eyespeed™ Twinax cable. Cable and board interconnects are intermateable.
For more information go to samtec.com/novaray.
AcceleRate® HD, High Density, High Speed Micro System
The ADM6, ADF6 series has up to 240 total I/Os in a mere 1.88” square inches (12.1 square cm) of pcb real estate. This is possible because the interconnect’s four rows of pins, on .635 mm pitch, available in up to 60 pins per row, with a slim 5 mm wide insulator footprint. The mated stack height is a low 5 mm, with 7 mm and 10 mm stack heights to follow.
The system incorporates the Edge Rate® contact system, which is optimized for signal integrity performance. It is rated to 56 Gbps with PAM4 modulation.
Solder ball technology, for simplified processing, is standard, as are alignment pins and body polarization. The products are RoHS compliant and lead-free solderable.
AcceleRate® Cable Assembly
Samtec’s AcceleRate® cable assembly is the slimmest in the industry with a 7.6 mm body width ideal for closer proximity to the IC. The high-density 2-row design features 8 and 16 pair configurations on a 0.635 mm pitch for up to 92 pairs per square inch.
Rated to 56 Gbps PAM4, this assembly supports Samtec’s flyover technology by flying signals over lossy PCB via ultra-low skew twinax Eye Speed® cable. This proprietary co-extruded cable supports next-generation performance with extended reach and system flexibility.
Flyover QSFP28 Double Density
Samtec’s FQSFP-DD is the first product to take the flyover architecture concept to the QSFP-DD form factor. The QSFP-DD form factor focuses on a next generation high-density, high-speed pluggable backwards compatible module form factor. The Samtec FQSFP-DD flyover product meets this challenge with greater performance margin compared to the QSFP-DD connector-to-PCB approach.
As advanced 50 Gbps+ per channel ASIC and FPGA solutions hit the market, a next-generation flyover approach that overcomes the limitations of signal loss on a PCB trace continues to become more relevant. QSFP-DD pluggable modules quadruple the aggregate bandwidth of conventional QSFP modules by doubling the channel data rates and doubling the system channel count. Systems designed for QSFP-DD modules will be backwards compatible with existing QSFP plug-in modules and provide increased flexibility for end users, network platform designers and integrators.
Samtec’s Flyover QSFP28 Systems provide improved signal integrity and architectural flexibility by flying critical high-speed signals over lossy PCB materials and directly to the panel via ultra-low skew twinax cable. Double density flyover increases throughput over QSFP by adding a second row of contacts enabling support for an eight-lane electrical interface. This is the FQSFP-DD series.
High-Speed Backplane – ExaMAX® and XCede® HD
ExaMAX® Direct Mate Orthogonal solutions remove the mid-plane, which allows fabric cards and line cards to mate directly and ultimately giving system designers increased flexibility. This architecture increases airflow and improves thermal efficiencies throughout the chassis. It also improves signal integrity, with shorter trace lengths and fewer connector transitions.
Leading equipment vendors from across the data center industry are leveraging the advantages of DMO, including storage, server, networking and other applications.
XCede® HD achieves significant space savings and flexibility on the backplane with a small form factor and modular design. A 1.80 mm pitch and up to 84 differential pairs per linear inch provide greater density than traditional backplane systems.
The modularity of XCede® HD gives designers the flexibility to create any configuration for a specific application. Modules include signal, power, guidance/keying and end wall options for increased system durability.
FireFly™ Micro Flyover System™
OK, FireFly™ isn’t really a “new” product, but it’s going to be all over DesignCon, so I have to mention it. The 28 Gbps FireFly optical engine is an industry-leading density cable system for markets like the 100 Gbps Datacom/Telecom and HPC. Designed for interchangeability, FireFly copper and optical both use the same micro connector system with easy insertion/removal and trace routing.
Available in extended temperature and PCIe®-over-Fiber versions, FireFly™ supports the latest Ethernet, InfiniBand™and Fibre Channel protocol specifications.
ExaMAX® is a registered trademarks of AFCI. XCede® HD is a registered trademarks of Amphenol.