OFC 2018 OFC 2018, The Optical Fiber Communication Conference and Exhibition, is the largest global conference and exhibition for optical communications and networking possibilities. Next-generation optical communication and networking applications must solve multiple technical challenges including higher data rates, increased system and chassis density, and improved signal integrity. Samtec’s diverse product and technology portfolio, which provide system designers with architectural … [Read more...]
Credo, Samtec 400 Gbps IEEE Ethernet Over Backplane Cable Assembly Demonstration
400 Gbps IEEE Ethernet, Backplane Cable Assembly Demonstration Ralph Page, Active Systems Manager at Samtec, and Alex Nazari of Credo Semiconductors, walk us through this combined Credo/Samtec 400 Gbps IEEE Ethernet over Backplane Cable Assembly demonstration. It provides an ideal proof-of-concept for long reach signals over cabled backplanes. This demonstration was first presented at DesignCon 2018 in Santa Clara, CA. Eight ports of 50+ Gbps PAM4 data are sourced from the Credo 50 … [Read more...]
Keysight, Samtec 56 Gbps PAM4 QSFP-DD Flyover Demo
This 56 Gbps PAM4 demonstration of a Keysight 32 port PXI VNA with Samtec Flyover™ interconnect systems was presented at DesignCon 2018. In this video, Keith Guetig (who is Samtec's answer to Matt Damon) explains how Samtec's Flyover™ designs provide a cost effective, high-performance answer to the challenges of 28 and 56 Gbps bandwidth, and beyond. A Keysight Keysight M9375A PXIe VNA sources 8 pairs of 56G-PAM4 reference channels. The 8 signal pairs route through a Samtec high … [Read more...]
Samtec and Xilinx 56 Gbps PAM4 Backplane Demonstration
56 Gbps PAM4 At DesignCon 2018, Matt Burns (Technical Marketing Manager of Samtec) and Ivan Madrigal (SerDes Systems Application Engineer at Xilinx®), walk us through a combined Xilinx-Samtec 56 Gbps PAM4 backplane demonstration. One port of 56Gbps PAM4 PBRS31 data is sourced from the transmitter of the Xilinx test chip containing GTM transceivers. The data routes through high-performance RF jumpers to a test paddleboard made of Isola Tachyon laminate material, through a mated Samtec … [Read more...]
Samtec + Credo 112 Gbps PAM4 Long Reach Cable Demonstration
Credo and Samtec teamed-up to to show an impressive 112 Gbps PAM4 long-reach cable demonstration at DesignCon 2018. In this video, Samtec's Ralph Page and Credo's Alex Narazi walk us through the demo and the results achieved. Signal Path Three ports of 112 Gbps PAM4 data are sources from the Credo 112 Gbps PAM4 CDRs. The signals are routed through RF jumpers to an SI characterization card for Samtec's next-gen AcceleRatee® Cable Assemblies. One data path is a signal while the … [Read more...]
TI and Samtec Demo 56 Gbps PAM4 over Backplane at DesignCon 2018
Next-gen speeds were all the buzz at DesignCon this week at the Santa Clara Convention Center in Silicon Valley. Vendors from across the industry were showcasing their latest solutions: semiconductors, connectors, test and measurement, EDA, etc. One popular solution was backplane connectors and applications. Faster speeds and new backplane system architectures were front-and-center in many of the DesignCon booths. TI/Samtec 56Gbps PAM4 Backplane Demo TI and Samtec partnered on a … [Read more...]
56 Gbps PAM4 Product Demonstrations At DesignCon 2018
56 Gbps PAM4, 112 Gbps PAM4, and 28 Gbps DesignCon is where Samtec showcases new products and product demonstrations that display high-speed technologies for Silicon-to-Silicon optimization. Our demos this year show interconnect systems in 56 Gbps PAM4, 112 Gbps PAM4, and 28 Gbps applications. Here's a list of the demos scheduled for DesignCon 2018: 56 Gbps PAM4 Demonstration Of Keysight PXIe VNA and Samtec Flyover™ A Keysight M937XA PXIe VNA sources 16 pairs of 56G-PAM4 data … [Read more...]
New High Density, AC Power Options On Power Connector
New Power Connector Options Increase Design and Performance Options Samtec’s EXTreme Ten60Power™ header and socket system (ET60T/ET60S Series) is available in both power/signal combinations and power only for increased design flexibility. A new 5-row signal option allows for up to 40 positions in the same form factor as the 3-row option. For higher density without the need for additional space, the 5-row design features a 2.00 mm pitch, versus the 3-row on a 2.54 mm pitch. The new AC power … [Read more...]
Samtec New Products At DesignCon 2018
Samtec will be introducing several new products at DesignCon 2018. All of these products are designed to increase data rates, increase system density, and shrink product footprints, so designers can meet their system signal integrity needs. NovaRay™ High Bandwidth, High Density Array Samtec’s NovaRay™ is an industry-leading high bandwidth, high-density interconnect system. The pin-to-ground differential pair configuration enables very low crosstalk to 40 GHz+, tight impedance … [Read more...]
Samtec’s DesignCon 2018 Conference Schedule
DesignCon 2018, which is a big deal for Samtec, is a few weeks away. Our high-speed technologies for Silicon-to-Silicon optimization will be on full display and our product experts will show new products that are just released, or will be released in 2018. Our application engineers will demonstrate new system-level solutions, and our SI experts will present technical papers. In the next few weeks we'll write about all of these products, demos, events, and presentations. To help you … [Read more...]
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