SEARAY™ is Samtec's line of high-speed, high-density grid array connectors. SEARAY gives designers tons of design flexibility, much more than any other array product in the industry. Flexibility SEARAY is a 1.27 mm X 1.27 mm grid. It is an open pin field grid array, meaning pins are not dedicated as signal or ground. Designers can specify pins for single-ended signals, differential pairs, ground, and/or power, all on the same connector. This gives designers maximum grounding and … [Read more...]
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New Avnet UltraZed-EV SoM Features Samtec SEARAY™ 0.80 mm High-Density Arrays
Samtec distributor partner Avnet recently released its new UltraZed-EV Starter Kit targeted at embedded vision applications. Comprised of the UltraZed-EV SoM and the UltraZed-EV Carrier Card, this kit offers engineers and designers a complete platform for prototyping and evaluating embedded video processing systems. The Avnet development team worked with Samtec to identify SEARAY™ 0.80 mm Pitch Ultra High-Density Arrays as the mezzanine connector between the SoM and Carrier Card. The … [Read more...]
New Heights for SEARAY™ High-Speed, High-Density Arrays
When faced with the need for more of something, one possible solution is expansion. This could take many forms but one simple way is extending it to be greater in size, such as adding the dining room table leaves to fit more people around the Thanksgiving table. Samtec’s SEARAY™ product family is already the industry’s largest offering of high-speed, high-density, open-pin-field arrays, but there’s always room for more at the table. The addition of a 7.5 mm body height for the vertical socket … [Read more...]
NVIDIA Jetson Platforms Connect via Samtec SEARAY™ Open Pin Field Arrays
The growth of system-on-modules (SOMs) in embedded computing presents a paradigm shift in embedded design. Legacy electronics systems typically leveraged discrete chip-down designs. The circuit designer was responsible for the selecting, designing and routing of the CPU, Memory, I/O, power and analog circuitry within their application. EEs continuously met the technical challenges presented before them. As Moore's Law moves along, system-level electronic design using the discrete … [Read more...]
SEARAY High Speed, High Density Connector
SEARAY™ is a family of high speed, high density connectors. SEARAY gives designers tons of design flexibility, much more than any other array product in the connector industry. Design Flexibility SEARAY is on a 1.27 mm X 1.27 mm grid. This is an open pin field grid array, which means we don’t have pins dedicated as signal or ground. Designers can specify some pins for single-ended signals, some can be routed as differential pairs, some ground, and some for power, all on the same … [Read more...]
GPU Scalable Array Server Features SEARAY™
A number of embedded applications leverage the brute-force serial processing of x86 CPUs. Higher speed CPUs lead to higher performance embedded computers. This model works in general computing applications, but parallel computing solutions offer another option for high efficiency and performance. Graphics Processing Units (GPUs) differ from CPUs in basic architecture. GPUs contains a larger number of smaller and efficient cores designed for parallel processing. GPUs … [Read more...]
Samtec SEARAY™ High Density Arrays Continue to Expand
Samtec has a long history of developing mezzanine interconnect solutions that meet and exceed our customer’s expectations. Our legacy revolves around standard board-to-board connectors used in applications ranging from TV remotes to MRI machines. Our depth of solutions has grown as time has passed, but one family of products offers the density, performance and flexibility to support many high-speed board-to-board applications. SEARAY™ High-Density Open Pin Field Array's many features and … [Read more...]
New SEARAY™ High Density Press Fit Right Angle Socket
Samtec’s SEARAY™ high density, high-speed array interconnect is now available in a right angle, press-fit design. SEARAY™ The SEARAY™ high speed array system is a 1.27 mm pitch open pin field array for maximum grounding and routing flexibility. It is available with up to 500 I/Os, and the rugged Edge Rate® contact has low insertion and withdrawal forces to simplify pcb handling. SEARAY® is an Extended Life Product™ (ELP) and has passed 10 year mixed flowing gas (MFG) and high … [Read more...]
SEARAY™ Solder Joints Are Class 3, IPC-A-610
Samtec SEARAY™ SEAM, SEAF Series solder joints are now classified as Class 3 in the IPC-A-610 Rev F Standard. Class 3 is for high performance/harsh environment electronic products. This includes products where continual high performance or performance-on-demand is critical, equipment downtime cannot be tolerated, the end-use environment may be extremely harsh, and the equipment must function when required. Common examples include flight controls on an aircraft and life support or other critical … [Read more...]
High Density SEARAY™ .8 Saves 50% Board Space
Samtec's ultra high density open pin field arrays, created on an 0,80 mm pitch can save you up to 50% board space compared to standard 1,27 mm pitch grid arrays. High density socket arrays, our SEAF8 Series, and terminal arrays, our SEAM8 Series, come standard with patented rugged Edge Rate™ contacts, which are less prone to damage when “zippered” to unmate. SEARAY™ .8 is currently available up to 300 I/Os Two new options include an 8 row and a 10 row design which allow up to 500 I/Os. … [Read more...]
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