Increasing data demand requires faster data rates across the data center. This is especially true of the transceivers and pluggable cages and modules common to these applications. One company can't do it alone. MSAs continue to proliferate as component manufacturers, equipment providers and interested third parties collaborate to speed industry adoption. Samtec has recently joined two new MSAs: QSFP-DD800 and Open Eye. Both efforts will contribute to next-gen, high-speed copper and … [Read more...]
Samtec and Partners to Demonstrate 56/112 Gbps PAM4 Systems at ECOC 2019
The optical communications world will be centered in Dublin next week for ECOC Exhibition 2019. This is one of "the" events in the fiber optics world. ECOC features over 6,000 attendees and 330 exhibitor from around the globe. The industry will focus on networking, sharing ideas, learning and developing new business leads. Samtec and its partners will be demonstrating next-gen 56/112 Gbps PAM4 solutions in a variety of applications. As data rates get faster, Samtec's Flyover® … [Read more...]
A 112 Gbps High-Density Escape From The System ASIC To The Front Panel
In this video from EDI CON 2109, Samtec's Jignesh Shah explains how Samtec Flyover® offers a 112 Gbps high-density escape from the system ASIC to the front panel. This is a live demonstration of 112 Gbps PAM4 traffic using Credo Semiconductors mixed signal SERDES with Samtec Flyover technology. First, Jignesh walks us through the signal path: A Credo Firebird SERDES generates 31-bit PRBS data at 112 Gbps PAM4 data rates.The signals travel from the Credo test board, through precision … [Read more...]
A Connector Solution To Achieve 112 Gbps Data Rates
In the video above, Samtec's Jignesh Shah and Kevin Burt explain that as data rate requirements approach and surpass 112 Gbps PAM4, developers are challenged with balancing increasing throughput, scalability, and density demands with concerns such as power consumption, signal integrity, time-to-market, and of course cost. To hit these speeds, designers often have to use special board laminate materials with lower dielectric constants and dissipation factors. But the problem is, these … [Read more...]
Samtec to Demonstrate Next-Gen Architectures at AI Hardware Summit
"Artificial Intelligence" and "AI" are all the rage. From high frequency trading on Wall Street to improved drug development, AI affects more aspects of human lives daily. Many AI solutions harness the computing power of cloud connectivity, edge computing, data centers and HPC. There are any number of resources that discuss the best frameworks and learning algorithms. But what about the hardware? That is the goal of the AI Hardware Summit, being held September 17-18, 2019 at the Computer … [Read more...]
Samtec and Avnet Target 5G Antennas to Bits Solutions
mmWave. Massive MIMO. Beamforming. Full duplex. Connectors. Connectors? Yes, connectors. Really! This may seem like a new take on the old childhood game of "One of These Things". However, all of these technologies (and others) are directly related to developing next-generation 5g antennas and systems. System designers have been challenged with bringing disparate technologies together for wireless. However, system integration and industry partnerships are now making 5G development … [Read more...]
Samtec Expands VITA 57.4 with FMC+ Extender Card
Developing with FPGAs requires patience. Why? They are so flexible and configurable. System designers are only limited by their imagination. Prototyping with FPGAs also poses many challenges. It seems like there are new FMC / FMC+ solutions appearing daily. Sometimes the FPGA carrier card or development board can get crowded. How can that be fixed? VITA 57.4 FMC+ Extender Card Engineers prototyping with industry-standard FPGA evaluation and development kits often leverage the FMC+ … [Read more...]
Connector, Cable Systems For AI Hardware Design
In this video, Samtec's Ralph Page walks us through a live demonstration of a prototypical AI (artificial intelligence) hardware design. It shows PCB connectors and twinax cable systems with performance capabilities suitable for AI hardware applications. It’s a configurable, next-generation, possibly GPU-based system that combines a cable mesh backplane, a rigid-style backplane, high-speed edge card connectors, and precision RF interconnects. For example, this design could be based on … [Read more...]
New Intel FPGA Platform Features Samtec Interconnect
Transceivers. SerDes. XCVRs. Tx/Rx. Yada, Yada, Yada. FPGA designers want more of them. FPGA designers want them to be faster. Thankfully, the leading FPGA suppliers are answering the call. The Samtec blog features many solutions from Xilinx, but what about Intel? What options are they promoting? Intel® Agilex™ FPGA and SoCs Intel recently released their latest FPGA/SoC platform called Intel® Agilex™. This family leverages Intel's 10nm process technology and advanced architectures. … [Read more...]
Direct Connect To Silicon Package For High Performance
In this new video, Samtec's Kevin Burt introduces Samtec Direct Connect™. Direct Connect gives the benefit of exiting a higher number of lanes at low loss from the chip package, which can be very useful in both high performance computing and network switching applications, especially at 56G/112G PAM4. Samtec is the only company that offers both optical and copper connectivity to the same connector, giving designers the flexibility of choosing the appropriate solution for … [Read more...]
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