Check out this Xilinx blog post about a 28 Gbps backplane demo using two Xilinx VCU 109 eval boards talking to each other over a Samtec backplane system. This was at the Teraspeed (Samtec) booth at DesignCon 2015. Nice video! … [Read more...]
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“Causality De-Mystified” Is Best Paper Finalist At DesignCon 2015
Samtec’s paper “Causality De-Mystified” has been selected as a finalist for a Best Paper Award at DesignCon 2015. The papers are ranked in terms of Quality, Relevance, Impact, Originality and Commercial Content with the aggregate score determining the ranking. Papers with the highest ranking are selected for a Best Paper Award with the live presentation serving as the final award criteria. Awards for this year’s conference will be presented in January 2016 at DesignCon 2016. Causality is … [Read more...]
Papers, Product Demos, New Products At DesignCon 2015
Samtec, Inc., and Teraspeed® Consulting are presenting five technical papers, giving two physical high speed product demonstrations, and showcasing several new products at DesignCon 2015. Samtec’s new location is booth #943, and Teraspeed® Consulting is booth #1048. Samtec’s presentations are: Optimizing Symmetry in Open Pin Field Designs – Wednesday, January 28 – 2:50pm – 3:30pmCausality Demystified – Thursday, January 29 – 8:30am – 9:10am Teraspeed® Consulting’s presentations … [Read more...]
Samtec Demos PCIe Gen 3 Over Fiber At SC14
If you are at SC14 (SuperComputing) in New Orleans, swing by the Samtec booth (#956) and check out our two demos. One of them demonstrates remote PCI Express® (PCIe®) Gen 3 switching over fiber. The system demonstrated achieves x8 PCIe® Gen 3 data rates (8 GT/s, 64 Gb/s aggregate) to transmit 4k UHD video 100 meters upstream from a PCIe® SSD to a server and back downstream to a GPU linked to a 4k display. The demonstration uses Samtec’s unique PCIEO Series Active Optical cable assembly based … [Read more...]
12G SDI FPGA Mezzanine Card Targeting Xilinx Platforms
Fidus Electronic Development and inrevium has introduced the TB-FMCH-12GSDI, a 6G/12G SDI FPGA Mezzanine Card (FMC) targeting Xilinx platforms. Fidus uses six, 75 ohm Samtec HDBNC connectors, as well as SEARAY™ interconnect systems as specified in the VITA 57 standard. The six HDBNC connectors support: 1x 12G SDI input, 1x 12G SDI output, 3x 12G In or Out, and 1x Video Sync input. With onboard Sync separator and Clock Generator, the FMC can provide all necessary inputs to the FPGA. The FMC is … [Read more...]
0,80 mm Pitch Discrete Wire System Offers High Reliability with Space Savings
Samtec recently expanded its line of Tiger Eye™ products with a 0,80 mm pitch discrete wire system ideal for rugged applications where a highly reliable connection must be maintained. The micro pitch system increases contact density for greater space savings and features Samtec’s Tiger Eye™ contacts, which are designed for high reliability and high mating cycles. The Tiger Eye™ discrete wire socket cable assembly (SESDT Series) is available in a double row design with up to 40 total positions … [Read more...]
New Panel Mount Discrete Wire Cable Assembly
Samtec recently released a new panel mount discrete wire cable assembly as part of its Mini Mate® product family. This new panel mount discrete wire assembly is ideal for in-line connections required to pass through a panel. The assembly accommodates a panel thickness of .0329" (0,84 mm) to .0897” (2,28 mm). This .100" (2,54 mm) pitch Mini Mate® panel mount assembly (MRTD/MRTDT Series) is a double row terminal cable with up to 30 total positions and a choice of 20 to 30 AWG discrete wire in … [Read more...]
Samtec, FCI Sign Second Source Pact For ExaMAX
Samtec and FCI announced the signing of a second-source agreement for Samtec to manufacture, market and sell FCI’s ExaMAX® high speed backplane system. We will keep you posted as more details become available. View The Full Press Release PDF Click here for a product overview: http://samtec.com/examax … [Read more...]
Julian Ferry Interview On High Speed Interconnect Design Developments
Julian Ferry, Samtec’s High Speed R&D Manager, recently spoke to Connector Supplier about the latest developments in high speed interconnects, the applications driving them, and how Samtec is meeting the challenges. Here is a full copy of the interview, courtesy of Connector Supplier. Q&A: Samtec on Signal Integrity. By Patricia Staino, June 16, 2014 Recently we spoke to Julian Ferry, high-speed R&D manager at Samtec, to learn more about the latest developments in high-speed … [Read more...]
Sealed, High Density IP67 Mini Push-Pull System
Samtec's new AccliMate™ Sealed Mini Push-Pull system is IP67 protected against dust and water, making it ideal for harsh environments and high density applications. The system is constructed of lightweight plastic and designed with a small round form factor for increased density on the panel. These are available as the MCP-8 and MCR-8 Series This sealed cable system is intermateable with the Hirose HR30 Series, allowing for ease of integration into existing systems. The cable-to-cable … [Read more...]