Samtec’s new SEARAY™ 0.80 mm pitch ultra-high density array cable assemblies provide 50% board space savings compared to 1.27 mm pitch systems. With performance to 15 Gbps and up to 300 total Edge Rate® contacts, this cable system is designed for rugged high speed applications where space is limited. High Speed Cable Assembly SEARAY™ 0.80 mm pitch array cable assembly -- the ESCA Series -- offers 50Ω single ended signal routing on 34 AWG micro ribbon coax cable, and it supports PCIe® … [Read more...]
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New SEARAY™ High Density Press Fit Right Angle Socket
Samtec’s SEARAY™ high density, high-speed array interconnect is now available in a right angle, press-fit design. SEARAY™ The SEARAY™ high speed array system is a 1.27 mm pitch open pin field array for maximum grounding and routing flexibility. It is available with up to 500 I/Os, and the rugged Edge Rate® contact has low insertion and withdrawal forces to simplify pcb handling. SEARAY® is an Extended Life Product™ (ELP) and has passed 10 year mixed flowing gas (MFG) and high … [Read more...]
Let’s Get Small … New Samtec Microelectronics Video
Check out the new Samtec Microelectronics Technology Center Video. It’s a an overview of our microelectronics and IC packaging capabilities, including precision die attach, ultra-fine pitch and low profile wire bond, flip chip, underfill, and dam and encapsulation, complete IC-to-board design, and support and manufacturing of IC packaging, substrates, micro high density interposers and micro optical engines. Samtec’s Technology Centers develop and advance technologies and products … [Read more...]
Download Samtec’s New Augmented Reality App
Samtec Reality, the Samtec augmented reality app, is now available for free as an App Store download and is compatible with any iPad Air. This app highlights the intricate design of our ExaMAX® high-speed backplane system by examining a rich, 3D image in real-time, in your environment. Click to Download the Samtec Augmented Reality Target Image Click to Download the Samtec Augmented Reality App How Does It Work? Click on the target image above and printDownload the app from the … [Read more...]
IEEE Working Group To Define High-Speed PCB Measurements
Have you ever received a measured Touchstone file from a vendor and felt the data was bad...or at least it had obvious passivity issues? Have you wanted to measure PCB traces and needed to de-embed the launch effects and found your data suspect? Maybe you wondered if you should trust the measured connector data above 20 GHz as the calibration traces were not the best? Getting high quality measured S-parameter data of embedded microwave structures is not a trivial effort, … [Read more...]
Survey Says …
As I write this post, I’m thrilled to report that Samtec was just ranked #1 in The Bishop and Associates European Customer Survey of the Electronic Connector Industry. This is the ninth (9th) time we are #1 in the European Survey. Even though this is an accomplishment we’re incredibly proud of and honored to receive, we’re not here to be obnoxious and stroke our egos. We’re here to make your life easier and provide the best interconnect products, service and support in the industry. … [Read more...]
Get the Target for the Next Generation “Samtec Reality” App
Click the Target Above to Print The next generation of the Samtec Reality app combines all the great features of our existing virtual product sample experiences – Augmented Reality and Virtual Product Explorer – into one amazing “super app” designed to provide an even more in-depth, user-friendly way to explore our latest technologies and products. How to Use the AR Feature: Click on the target image to download and print Click here to download the app from the App Store Open the … [Read more...]
Dissimilar Metals And The Risk of Galvanic Corrosion in Mating Connectors
I am fascinated by the concept of dissimilar metals and galvanic corrosion. I stayed up until 3:45 am last night surfing the web to learn more. Of course I'm lying, but we do field questions about galvanic corrosion. Robbie Huffman, Samtec's Interconnect Processing Engineer, recently shared some information on this subject with our Field Sales Engineers. I hope you find it helpful: When choosing connectors for your application, it is important to choose mating connectors with similar … [Read more...]
How To Specify High-Speed Mezzanine Connectors
Julian Ferry, Samtec’s Principle R&D Engineer, recently explained to our friends at Connector Supplier how choosing a connector for mezzanine board-to-board applications presents challenges in several engineering disciplines. Signal integrity concerns make the selection even more complex. Check out Julian’s article here. Julian discusses a variety of topics, including physical requirements, mechanical performance, considerations for high-speed data parameters such as return loss, … [Read more...]
More On 25+ Gbps Backplane Design
I recently posted a blog about videos of Teraspeed®’s Scott McMorrow explaining how he determined the materials to choose in order to achieve the best performance for a backplane system with a 25 Gbps+ operation. Xilinx’s Xcell Daily Blog also reported on these videos, and they tell us more about the setup, including eval boards used (Xilinx VCU109) and the FPGA selected (Virtex UltraScale VU095), among other details. Check out the Xilinx blog here. I encourage you to check out Xcell … [Read more...]