Check out the new Samtec Microelectronics Technology Center Video. It’s a an overview of our microelectronics and IC packaging capabilities, including precision die attach, ultra-fine pitch and low profile wire bond, flip chip, underfill, and dam and encapsulation, complete IC-to-board design, and support and manufacturing of IC packaging, substrates, micro high density interposers and micro optical engines.
Samtec’s Technology Centers develop and advance technologies and products that provide both performance and cost benefits. The goal is to ensure complete system optimization from the bare die to an interface 100 meters away, and all insertion points in between.
Samtec Technology Centers
Advanced Interconnect Design: High precision stamping, plating, molding, and automated assembly for fine pitch and array interconnects used for board-to-board, interposers, backplane, and high speed/high density cable assemblies.
High Speed Cable Plant: R&D and manufacturing of precision extruded micro coax and twinax cable used for high speed / high density cable assemblies, including 26-38 AWG, 50/75/85/100 ohm impedance, and systems rated at 28+ Gbps.
Microelectronics / IC Packaging: Precision die attach, ultra-fine pitch and low profile wire bond, flip chip, underfill, and dam and encapsulation, complete IC-to-board design, and support and manufacturing of IC packaging, substrates, micro high density interposers and micro optical engines.
Optical Group: Engineering team dedicated to the design, development, and application support of high performance micro optical engines, active optical assemblies, and high density ganged passive optical panel solutions.
Signal Integrity Group: In-house signal integrity expertise for complex applications, with live EE support available 24/7 worldwide. Advanced design support including Differential Vias™ and routing recommendations using Tri-Planar™ trace technology.
Teraspeed® Consulting: Signal integrity services team providing complete system design, full channel signal and power integrity analysis and modeling, thermal management, and signal integrity-optimized advanced IC packaging for 28+ Gbps and beyond.