Julian Ferry, Samtec’s Principle R&D Engineer, recently explained to our friends at Connector Supplier how choosing a connector for mezzanine board-to-board applications presents challenges in several engineering disciplines. Signal integrity concerns make the selection even more complex.
Check out Julian’s article here.
Julian discusses a variety of topics, including physical requirements, mechanical performance, considerations for high-speed data parameters such as return loss, insertion loss, and crosstalk, confirmation of a connector’s suitability through full-channel simulations such as SPICE or S-parameter models, and system certification based on channel operating margin (COM).
Additional Related Links:
- High-Speed Board-to-Board Interconnects
- High-Speed Cable Assemblies
- Teraspeed® Consulting
- Samtec MicroElectronics
- Julian’s Article
- Connector Supplier
- Interconnect Signal Integrity Handbook