56 Gbps PAM4 At DesignCon 2018, Matt Burns (Technical Marketing Manager of Samtec) and Ivan Madrigal (SerDes Systems Application Engineer at Xilinx®), walk us through a combined Xilinx-Samtec 56 Gbps PAM4 backplane demonstration. One port of 56Gbps PAM4 PBRS31 data is sourced from the transmitter of the Xilinx test chip containing GTM transceivers. The data routes through high-performance RF jumpers to a test paddleboard made of Isola Tachyon laminate material, through a mated Samtec … [Read more...]
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Samtec Features Latest Interconnect Options for HPC Applications at SC21
The global high-performance computing (HPC) ecosystem comes together each year at SuperComputing. SC21 offers data analysts and scientists, system architects, and design engineers the opportunity to learn, network and explore the latest in HPC solutions. In 2020, the vent was fully virtual due to the global coronavirus pandemic. This year, the event will be hybrid. There will be an active online component. Additionally, representatives from industry, academia and governmental agencies will … [Read more...]
Xilinx Kria™ Adaptive SoMs Feature Samtec AcceleRate® HD Slim Body Arrays
Rapidly-growing AI system capabilities are driving new product architectures that demand increased speeds, bandwidths, frequencies and densities. Scalability and configurability are a must. In embedded applications, many AI systems leverage the ease of design and economies of scale of systems-on-modules (SoMs). System-on-modules are an example of make or buy system design. A SoM includes the system compute engine (MCU, FPGA, GPU, etc.) as well as general support circuitry like DRAM, power and … [Read more...]
56 Gbps PAM4 Connector Set: A New Live Demonstration
This live product demonstration shows a Samtec high-speed, high-density connector system running at 56 Gbps PAM4, with excellent performance. Adam Page, Software Architect at Samtec, walks us through this demonstration, which is powered by a Xilinx® Virtex® UltraScale + 56 Gbps PAM4 VCU 129 FPGA Evaluation Kit. The demo also includes a Samtec SI Evaluation Kit for the SEARAY™ high-density array products. SEARAY is a 1.27 mm pitch array connector system that allows maximum routing and … [Read more...]
Demonstration of New Micro Edge Card Connector at 56 Gbps PAM4
This active product demonstration, of a connector system running at 56 Gbps PAM4, incorporates a Xilinx® Virtex® UltraScale+™ VCU 129 FPGA Evaluation Kit, and Samtec SI Evaluation boards with our new HSEC6 micro edge card connector. The HSEC6 connector is a .6 mm pitch, micro-pitch, high-speed edge card connector. Ralph Page, Systems Architect at Samtec, explains the set-up and discusses the performance of the system. Signal Path The Xilinx Virtex UltraScale+ FPGA is generating … [Read more...]
New 56 Gbps PAM4 Connector SI Evaluation Kit Demo
Ralph Page, Systems Architect at Samtec, walks us through a live product demonstration of a Samtec high-speed connector running at 56 Gbps PAM4, with incredible performance. It can also be run up to 28 Gbps NRZ. This active product demonstration uses a Xilinx® Virtex® UltraScale+ 56 Gbps PAM4 VCU 129 FPGA Evaluation Kit. The connector we’re evaluating is a Samtec HSEC8-DP. It’s a micro-pitch, high-speed edge card connector, for differential pair configurations. Check-out HSEC8-DV … [Read more...]
Samtec Exhibits at XDF 2019 Asia in Beijing
The global XDF technology road shows come to Beijing next week. FPGA designers, system architects, data scientists and other technical leaders will gather December 3-4, 2019 at the China National Convention Center. Samtec technical experts and our partners will demonstrate some of the latest interconnect solutions affecting the Xilinx FPGA ecosystem. Samtec Interconnect on Xilinx Kits One of several demonstrations at XDF 2019 Asia shows the variety of Samtec interconnects supporting … [Read more...]
SC19: Samtec Launches New 56/112 Gbps PAM4 Demos
Scientists, researchers, and data analysts from academia, industry and government agencies will be center stage at SC19 next week in Denver. SC19 is the International Conference for High Performance Computing, Networking, Storage, and Analysis. Next-generation high-performance copper and optical interconnects must solve multiple technical challenges including higher data rates, increased system and chassis density and improved signal integrity. Samtec’s diverse product and technology … [Read more...]
Samtec Joins Open Eye and QSFP-DD800 MSAs
Increasing data demand requires faster data rates across the data center. This is especially true of the transceivers and pluggable cages and modules common to these applications. One company can't do it alone. MSAs continue to proliferate as component manufacturers, equipment providers and interested third parties collaborate to speed industry adoption. Samtec has recently joined two new MSAs: QSFP-DD800 and Open Eye. Both efforts will contribute to next-gen, high-speed copper and … [Read more...]
Samtec and Avnet Target 5G Antennas to Bits Solutions
mmWave. Massive MIMO. Beamforming. Full duplex. Connectors. Connectors? Yes, connectors. Really! This may seem like a new take on the old childhood game of "One of These Things". However, all of these technologies (and others) are directly related to developing next-generation 5g antennas and systems. System designers have been challenged with bringing disparate technologies together for wireless. However, system integration and industry partnerships are now making 5G development … [Read more...]
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