Rapidly-growing AI system capabilities are driving new product architectures that demand increased speeds, bandwidths, frequencies and densities. Scalability and configurability are a must. In embedded applications, many AI systems leverage the ease of design and economies of scale of systems-on-modules (SoMs).
System-on-modules are an example of make or buy system design. A SoM includes the system compute engine (MCU, FPGA, GPU, etc.) as well as general support circuitry like DRAM, power and expansion connectors. SoMs typically attached application-specific carrier cards via high-performance expansion connectors.
SoMs offer many advantages to discrete, chip-down designs. This includes faster time to market, reduced development costs and a scalable product range. Plus, OEMs using SoMs can focus on key system features instead of a complex, digital chip down design.
Xilinx Kria Adaptive System-on-Module
FPGA and SoC-based SoMs are becoming more popular, especially for AI-focused applications. Xilinx Kria Adaptive SoMs offer unmatched AI performance via pre-built hardware and software. Kria is a compact embedded platform that integrates a custom built Zynq® UltraScale+™ MPSoC that runs optimally (and exclusively) on the SOM with DDR memory, nonvolatile storage devices, a security module, and an aluminum thermal heat spreader.
The SOM is designed to be plugged into a carrier card with solution-specific peripherals. Kria is offered in commercial and industrial temperatures ranges. Key target applications include smart city, machine vision, industrial robotics, and AI/ML computing.
Kria Expansion Connectors
Kria SoMs feature a pair AcceleRate HD Ultra-Dense Slim Body Arrays. The 240-pin connectors provide electrical connectivity between the SOM and the carrier card. These two connectors are referred to as SOM240_1 and SOM240_2. An AcceleRate HD socket (ADF6–60–03.5–L–4–2–A) is used on the bottom side of the SOM. An AcceleRate HD terminal (ADM6–60–01.5–L–4–2–A) is for use on the carrier card.
The SOM240_1 and SOM240_2 connectors provide support for following interfaces:
- Control and status signals
- Multiplexed I/O (MIO) bank
- PS-GTR high-speed serial transceiver signals
- High-performance I/O (HPIO) bank signals
- High-density I/O (HDIO) bank signals
- GTH high-speed serial transceiver signals
- Power system
Obviously, the link between the Kria SoM and Kria Carrier Card is detailed. Xilinx’s Kria SOM Carrier Card Design Guide offers key design criteria for system architects, embedded designers and system integrators.
AcceleRate HD Ultra-Dense Slim Body Arrays
AcceleRate HD features high-speed Edge Rate® contacts designed for high-speed, high-cycle applications. The surface of the contact is milled, creating a smooth mating surface which reduces wear on the contact. This increases durability and cycle life. Also, lower insertion and withdrawal forces allow zippered mating and unmating.
Key features include:
- Incredibly dense with up to 240 total I/Os; up to 400 in development
- Low profile 5 mm stack height
- Slim 5 mm width
- 4-row design; 10 – 60 positions per row (70 – 100 total positions per row in development)
- Edge Rate® contact system optimized for signal integrity performance
- Open-pin-field design for grounding and routing flexibility
- Supports 56 Gbps PAM4 (28 Gbps NRZ) applications
- PCIe® GEN 5 compatible
- Solder ball technology for simplified processing and self aligning
- 7 – 16 mm stack heights, right-angle and cable in development
Please visit www.samtec.com/accelerateHD for more information.