Scientists, researchers, and data analysts from academia, industry and government agencies will be center stage at SC19 next week in Denver. SC19 is the International Conference for High Performance Computing, Networking, Storage, and Analysis.

Next-generation high-performance copper and optical interconnects must solve multiple technical challenges including higher data rates, increased system and chassis density and improved signal integrity.
Samtec’s diverse product and technology portfolio provides system architects, designers and SI engineers architectural solutions to the challenges faced by the HPC industry. This is especially true at 56/112 Gbps PAM4 data rates at SC19.
Samtec and its partners will feature an extensive number of demos in Booth 343 at SC19. Solutions include front-panel, mid-board and backplane connectors and copper and optical cable assemblies.

Here is a partial demo list:
- 56 Gbps PAM4 Direct Connect to Silicon Package for HPC Applications
- Submersible 112 Gbps (4×28 Gbps) Optical Transceiver For AI/HPC
- 112 Gbps PAM4 Front-Panel to Mid-board and Mid-Board to Backplane
- eSilicon and Samtec Demonstrate Next-Gen Data Center Architectures
- 56 Gbps PAM4 Active Product Demonstrator
- Scalable 32 GT/s Silicon Test Platform for AI
New 448 Gbps (16×28 Gbps) Fiber Optic Development Platform
Readers of the Samtec blog are aware of numerous solutions available that support the FireFly™ Micro Flyover System™. Most platforms available are typically associated with Xilinx FPGAs like the VCU118.
In parallel, Samtec and Paris-based Reflex CES have collaborated to create a new platform featuring Intel Stratix® 10 FPGA. Combined solutions from both companies result in a new 448 Gbps (16×28 Gbps) fiber optic development platform.

The Sargon Stratix® 10 FPGA FMC+ Instant Development Kit from REFLEX CES provides FPGA developers the best out-of-the-box experience, combining the best in class compact hardware platform with the most efficient intuitive software environment.
Samtec’s 25/28 Gbps FireFly FMC+ Development Kit provides up to 448 Gbps full-duplex bandwidth over 16 channels from an FPGA to an industry-standard multi-mode fiber optic cable or optical loopbacks.
Attend and Learn More
Stop by Samtec Booth 343 at SC19 for more details on these demos.
Please visit Samtec’s SC19 landing page before the event.
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