Choosing the right plating is critical to the success of a connector system. Plating affects the connector's performance, life cycle, quality, and cost. Let’s begin with cost. A recent blog explains that the major costs in a connector are the plastic body, the pins, plating on the pins, the labor to assemble it, and the packaging. And with most connectors, the bigger ticket items are the pins and the plating. For example, on a micro pitch, high density interconnect product, the pin and … [Read more...]
Samtec FireFly™ Routes Data over PCBs in New Guzik ADP7000 Series Digitizers for 5G NR
As consumers, no one ever complains that their wireless connectivity is "too fast". Global wireless carriers and network providers continue to push the limits of 4G LTE, but a next-generation wireless standard - 5G New Radio (5G NR) - is on the horizon. 5G technology will be 100x faster than current 4G LTE solutions currently on the market. While some early adopters will see 5G rollouts in late 2017 and early 2018, large-scale deployments are planned for 2019, a year earlier than … [Read more...]
Samtec Rewrites the VITA 42 Story
Everyone loves a good book. From Shakespearean classics to more modern-day masterpieces, a solid story can leave a lasting impression. While the VITA family of standards isn't necessarily a book, it does have a rich history with a large impact. As we learned in a previous blog, standards are always progressing, and, in this case, so is VITA 42. What does that mean to the connector industry, and how has VITA 42 changed with Samtec? To get a solid grasp on these questions and more, let's … [Read more...]
September Updates to Samtec.com
With our last web update, we brought you several new additions to our on-site search, a new Microelectronics web experience, and our new 2017 product overview guide. In September, the updates to search came to a close (for now), we've added a few new content pages, and we began work on several architecure upgrades to increase the performance of Samtec.com. These will pave the way for our next set of applications coming in 2018 and beyond. Here is the summary of our major web updates for … [Read more...]
Comparing Base Metals In Connectors
I’ll start this blog with two questions. First, what are the major costs to build a connector? Second, which of these are the bigger costs? In other words, what is the most expensive part of a connector? (Quick aside: I can’t speak for all connector companies when it comes to costs. The majority of examples I’m using in this blog relate to Samtec interconnects, but I bet the principles apply to other connector companies as well.) Connector Costs The major costs in a connector are … [Read more...]
New Optical Data Interface Adopts Samtec FireFly™ As Physical Layer
Emerging applications in 5G communications, mil/aero systems, high-speed data acquisition, phased-array radar and communication research will support faster data rates than current generation solutions. Developing and testing these high-performance applications requires advanced instrumentation and embedded systems. Current generation instruments, processors, storage, and embedded devices communicate over copper interfaces in standard form factors and traditional bench instrument … [Read more...]
NVIDIA Jetson Platforms Connect via Samtec SEARAY™ Open Pin Field Arrays
The growth of system-on-modules (SOMs) in embedded computing presents a paradigm shift in embedded design. Legacy electronics systems typically leveraged discrete chip-down designs. The circuit designer was responsible for the selecting, designing and routing of the CPU, Memory, I/O, power and analog circuitry within their application. EEs continuously met the technical challenges presented before them. As Moore's Law moves along, system-level electronic design using the discrete … [Read more...]
Samtec Releases New Low-Profile PCI Express® Edge Card Connector
A low-profile object is defined as lower or slimmer than what is typical. Samtec’s new low-profile PCI Express® Gen 4 edge card connector fits the bill. It is designed to meet the industry demands for greater density and higher performance in compact electronics. Low-Profile Saves System Space This new low-profile edge card connector (PCIE-LP Series) is PCI Express® Gen 4 compliant and supports one, four, eight and sixteen links for different bandwidth requirements. It also features Edge … [Read more...]
Samtec Expands ExaMAX® High-Speed Backplane Connector System With New DMO Options
Networking switches and hubs in next-generation hyperscale data centers must support increased port density and higher data rates. In combination with increased processing power, system designers are leveraging the inherent advantages of direct mate orthogonal architectures when compared with traditional backplane systems. Samtec supports orthogonal backplane architectures with new DMO options from within the ExaMAX® High-Speed Backplane Connector System. Samtec ExaMAX® DMO … [Read more...]
More Than Just Connectors: Samtec’s Interconnect Processing Group
So you've finally found the right connector for your design. With low stack heights, SnPb finish on the tail, and a highly rated normal force, this should solve your signal integrity problems and be the connector/cable of your dreams, right? Well first of all, if you dream about connectors, something may be off. More importantly, interconnect processing may also be involved in fully designing any of Samtec's interconnect solutions into your design. Samtec's Interconnect Processing Group … [Read more...]
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