Eric Bogatin, Signal Integrity guru and friend of Samtec, recently posted a blog on “Best Practices For Connector Models.” He posted this on his Signal Integrity Journal website. Eric spoke with two of the worlds’ experts on high frequency electrical characterization of interconnects: Samtec’s own Jim Nadolny, our Principle SI Engineer, and Heidi Barnes, the ADS application engineering specialist with Keysight Technologies. Heidi and Jim cover a lot of topics, from S-parameter … [Read more...]
The Grounds Behind Grounding
A few weeks ago, I was working on an audio amplifier with my dad in the garage. As I began to wire it up to test a new set of speakers we had bought, I received a nasty shock when plugging in an older, frail patch cable. Now, something didn’t seem to add up here; I had used this cable before on my equipment and never had problems. However, in this instance, something was different; the older tube amplifier we were using had no ground. In today’s industry and even in household use, electrical … [Read more...]
Samtec Releases “Expanding the Backplane Ecosystem” ChalkTalk
Samtec is pleased to announce a new ChalkTalk entitled "Expanding the Backplane Ecosystem." Hosted by EEJournal, this newly released ChalkTalk details the growing backplane connector portfolio from Samtec. Samtec entered the backplane connector market by licensing FCI's ExaMAX® High-Speed Backplane Connector System. Over the past few years, Samtec has developed numerous soon-to-be-released backplane connector mated pairs. Samtec has also developed power delivery and guide post … [Read more...]
Solving Signal Integrity Problems At Very High Data Rates
Our friends at EDN recently published Solving Signal Integrity Problems At Very High Data Rates. The article - written by Lee Ritchey and Kella Knack from Speeding Edge and Teraspeed's own Scott McMorrow - discusses the challenges of achieving high data rates given parasitics in PCBs. It presents a novel, alternative design approach to the problem. To elaborate a bit ... Advances in semiconductor technology are making it possible to connect components in … [Read more...]
Autonomous Vehicles: Successfully Integrating New Chips, Packages, and Modules (Part 2)
Steve Groothuis, CTO of Samtec Microlectronics, recently conducted a workshop at the Autonomous Vehicles 2016 Conference and Workshop. Steve’s presentation is “Autonomous Vehicles: Successfully Integrating New Chips, Packages, and Modules.” This is second installment in a two-part article with a video of the conclusion of Steve's workshop presentation. Here is the link to the first blog, with the first half of the video. With autonomous vehicles currently being … [Read more...]
Autonomous Vehicles: Successfully Integrating New Chips, Packages, and Modules (Part 1)
The auto industry is poised for more change in the next five to ten years than it’s seen in the past 50. That quote, from Mary Barra, CEO of General Motors, illustrates the driving force (no pun intended) for increasingly complex electronics in vehicles. Steve Groothuis, CTO of Samtec Microlectronics, recently conducted a workshop at the Autonomous Vehicles 2016 Conference and Workshop. Steve’s presentation is “Autonomous Vehicles: Successfully Integrating New Chips, Packages, … [Read more...]
JSOM Standoffs Ease PCI/104-Express™ PCB Stacking
The term “interchangeable parts” became popular towards the mid to late 19th century. As the Industrial Revolution began in the United States, a man named Eli Whitney demonstrated this concept by disassembling and reassembling a pile of the exact same firearms in front of Congress. The idea rapidly caught on leading to weapons, farming equipment, machines etc. all using the same parts. Fast-forward to our day; interchangeable parts contribute especially with computers. … [Read more...]
Building a Solid Connection: Tin vs. Gold
Contact materials have always been a subject of debate in the electronics industry. Innovation and industrialization have both pioneered and degraded universal standards of contact designs. Although you could sit around all day to argue which conductor/metal is the better choice, any discussion of contacts must address the plating material selected for the application, primarily gold vs. tin. Demonstrating the pros and cons of both materials will allow consumers to determine … [Read more...]
Gaining an Edge in PCB Design: The Evolution of the Edge Card
1944. America was in the heat of World War II and continually seeking new and more advanced options against her enemies. One such device was the proximity sensor used to disable and destroy enemy aircraft from a distance. However, a significant problem arose; the electrical signal had to be small yet rugged enough to be able to be placed inside and fired from a gun to enable the sensor from miles away. This engineering challenge sparked the development of microelectronics and PCBs. Over … [Read more...]
Come Fly With Me
Traveling to a far-away destination usually involves a choice: do I drive or do I fly? Driving entails a slower pace and traffic while flying allows a direct connection to your final destination for around the same price. This simple analogy illustrates choices electronics designers face in getting data from point A to point B. Technology advancement drives added functionality in many of today’s popular applications. OEMs are responding by adding computing and processing power via advanced … [Read more...]
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