Designers periodically ask us for a "general bandwidth performance rating" to compare two or more interconnect systems. Of course numerous variables affect the signal integrity performance of an interconnect, so a one-size-fits-all approximation definitely does not fit all. Now, a new approach allows system signal integrity engineers to compare relative performance of connectors and cable assemblies while factoring in noise contributions from and interactions with other parts of the … [Read more...]
Samtec Releases “SI? Why do I Care” ChalkTalk
Samtec is pleased to announce a new ChalkTalk entitled “SI? Why do I Care?.” Hosted by EEJournal, this newly released ChalkTalk details SI basics and how they affect connector selection. SI not just for "Experts” Most designs these days have high-speed interfaces that require a solid strategy for SI. This calls for understanding the "basics" of SI. The ChalkTalk defines each of the following terms and how it relates to connector selection and simulation. Insertion Loss … [Read more...]
Strength in Design: Variable Connector Material Options
Selecting the right interconnect systems helps ensure your design will meet the standards it is supposed to meet – whether it is a high-cycle application, or high shock and vibration, or an interconnect that is going to see very little stress in its life. The truth of the matter is, your design is only as good your connections. In addition to stacking height, pitch, solderability and a long list of other options, it is equally crucial to analyze which type of conducting metal or alloy … [Read more...]
Best Practices For Connector Models
Eric Bogatin, Signal Integrity guru and friend of Samtec, recently posted a blog on “Best Practices For Connector Models.” He posted this on his Signal Integrity Journal website. Eric spoke with two of the worlds’ experts on high frequency electrical characterization of interconnects: Samtec’s own Jim Nadolny, our Principle SI Engineer, and Heidi Barnes, the ADS application engineering specialist with Keysight Technologies. Heidi and Jim cover a lot of topics, from S-parameter … [Read more...]
The Grounds Behind Grounding
A few weeks ago, I was working on an audio amplifier with my dad in the garage. As I began to wire it up to test a new set of speakers we had bought, I received a nasty shock when plugging in an older, frail patch cable. Now, something didn’t seem to add up here; I had used this cable before on my equipment and never had problems. However, in this instance, something was different; the older tube amplifier we were using had no ground. In today’s industry and even in household use, electrical … [Read more...]
Samtec Releases “Expanding the Backplane Ecosystem” ChalkTalk
Samtec is pleased to announce a new ChalkTalk entitled "Expanding the Backplane Ecosystem." Hosted by EEJournal, this newly released ChalkTalk details the growing backplane connector portfolio from Samtec. Samtec entered the backplane connector market by licensing FCI's ExaMAX® High-Speed Backplane Connector System. Over the past few years, Samtec has developed numerous soon-to-be-released backplane connector mated pairs. Samtec has also developed power delivery and guide post … [Read more...]
Solving Signal Integrity Problems At Very High Data Rates
Our friends at EDN recently published Solving Signal Integrity Problems At Very High Data Rates. The article - written by Lee Ritchey and Kella Knack from Speeding Edge and Teraspeed's own Scott McMorrow - discusses the challenges of achieving high data rates given parasitics in PCBs. It presents a novel, alternative design approach to the problem. To elaborate a bit ... Advances in semiconductor technology are making it possible to connect components in … [Read more...]
Autonomous Vehicles: Successfully Integrating New Chips, Packages, and Modules (Part 2)
Steve Groothuis, CTO of Samtec Microlectronics, recently conducted a workshop at the Autonomous Vehicles 2016 Conference and Workshop. Steve’s presentation is “Autonomous Vehicles: Successfully Integrating New Chips, Packages, and Modules.” This is second installment in a two-part article with a video of the conclusion of Steve's workshop presentation. Here is the link to the first blog, with the first half of the video. With autonomous vehicles currently being … [Read more...]
Autonomous Vehicles: Successfully Integrating New Chips, Packages, and Modules (Part 1)
The auto industry is poised for more change in the next five to ten years than it’s seen in the past 50. That quote, from Mary Barra, CEO of General Motors, illustrates the driving force (no pun intended) for increasingly complex electronics in vehicles. Steve Groothuis, CTO of Samtec Microlectronics, recently conducted a workshop at the Autonomous Vehicles 2016 Conference and Workshop. Steve’s presentation is “Autonomous Vehicles: Successfully Integrating New Chips, Packages, … [Read more...]
JSOM Standoffs Ease PCI/104-Express™ PCB Stacking
The term “interchangeable parts” became popular towards the mid to late 19th century. As the Industrial Revolution began in the United States, a man named Eli Whitney demonstrated this concept by disassembling and reassembling a pile of the exact same firearms in front of Congress. The idea rapidly caught on leading to weapons, farming equipment, machines etc. all using the same parts. Fast-forward to our day; interchangeable parts contribute especially with computers. … [Read more...]
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