Contact materials have always been a subject of debate in the electronics industry. Innovation and industrialization have both pioneered and degraded universal standards of contact designs. Although you could sit around all day to argue which conductor/metal is the better choice, any discussion of contacts must address the plating material selected for the application, primarily gold vs. tin. Demonstrating the pros and cons of both materials will allow consumers to determine … [Read more...]
Gaining an Edge in PCB Design: The Evolution of the Edge Card
1944. America was in the heat of World War II and continually seeking new and more advanced options against her enemies. One such device was the proximity sensor used to disable and destroy enemy aircraft from a distance. However, a significant problem arose; the electrical signal had to be small yet rugged enough to be able to be placed inside and fired from a gun to enable the sensor from miles away. This engineering challenge sparked the development of microelectronics and PCBs. Over … [Read more...]
Come Fly With Me
Traveling to a far-away destination usually involves a choice: do I drive or do I fly? Driving entails a slower pace and traffic while flying allows a direct connection to your final destination for around the same price. This simple analogy illustrates choices electronics designers face in getting data from point A to point B. Technology advancement drives added functionality in many of today’s popular applications. OEMs are responding by adding computing and processing power via advanced … [Read more...]
Samtec Launches Silicon-to-Silicon™ System Optimization Microsite
Increasing data rates, denser systems and shrinking product footprints challenge designers to meet their system signal integrity needs. Samtec’s Silicon-to-Silicon™ System Optimization capabilities provide engineers the service, products, tools and resources to optimize the entire signal chain of a system, from bare die to IC package and assembly, to PCB, to connectors and cable assemblies, and back again. Gaining access to all of these capabilities can be daunting for those not familiar … [Read more...]
Samtec Announces Acquisition Of nMode Solutions and Triton Microtechnologies
Advanced Technologies Augment Samtec Technology Roadmap for 3-D Packaging, Sensor Modules, and Wireless Connectivity New Albany, IN, May 31, 2016 – Samtec, Inc., a leading provider of high bandwidth and micro-pitch interconnect systems, announced today the acquisition of nMode Solutions, of Oro Valley, Arizona. “The acquisitions of nMode Solutions and their subsidiary, Triton Microtechnologies, is a critical next step in Samtec’s technology roadmap. This furthers our … [Read more...]
Xilinx and Samtec Deepen Technical Collaboration
Higher data rates in today’s bleeding edge ICs require constant innovation in interconnect to route signals on PCBS and between them. Samtec’s Silicon to Silicon System Optimization provides engineers the service, products, tools and resources to optimize the entire signal path from bare die to IC package and assembly to PCB to connectors and cable assemblies and back again. A practical case study in our Silicon to Silicon System Optimization capabilities is leading FPGA vendor Xilinx. … [Read more...]
Guidelines For Paste-In-Hole Reflow Processing
Many Samtec customers employ Paste-In-Hole (PIH) processing. Very simply put, this is the process of screening solder paste into and around plated through-holes on a pcb, and placing the leads of through-hole components -- like connectors -- in these prepared through-holes. The boards are run through a reflow soldering process, thus terminating both through-hole and SMT components in one reflow process. Advantages of Paste-In-Hole Technology It saves time because it employs only one … [Read more...]
Eric Bogatin’s Three Predictions On The State Of Signal Integrity
Signal Integrity expert Eric Bogatin recently shared three predictions on the state of signal integrity. Based on his discussions at DesignCon 2016 and thereafter, Eric has three predictions about major changes ahead for high speed serial link systems. The first is the rollout of 28 Gbps systems will be slower than expected. Eric explains that the semiconductor companies producing the CMOS devices – ASIC, FPGA or custom – are doing fine producing the silicon with acceptable performance at 28 … [Read more...]
14 Gbps Optical Link In FMC VITA 57.1 Form Factor For FPGA Applications (OFC 2016)
Kevin Burt, of the Samtec Optical Group, discusses one of two demonstrations at OFC 2016. This is a demo of a FireFly™ 14 Gbps optical link in a FMC VITA 57.1 form factor for FPGA applications, for the high performance computing, rugged military, and industrial markets, to name a few. This demo is an optical interconnection between two FPGAs, with a Xilinx Development Card and two FMCs (FPGA mezzanine cards), one from TechWay and the other from Crossfield Technology. This is 8 lanes of 14 … [Read more...]
Optimize Bandwidth With The Signal Integrity Group and Teraspeed
You can’t talk about electronics without talking about the ever-increasing need for bandwidth. Samtec interconnect products are designed to optimize signal integrity by focusing on the connector footprint configuration, pin geometry, and plastics and dielectrics, to list just a few of many design considerations. But even the “fastest” connector, by itself, has limited bandwidth performance. Obviously addressing these increased bandwidth requirements necessitates a systems-level approach, … [Read more...]
- « Previous Page
- 1
- …
- 15
- 16
- 17
- 18
- 19
- …
- 21
- Next Page »