Kevin Burt, of the Samtec Optical Group, discusses one of two demonstrations at OFC 2016. This is a demo of a FireFly™ 14 Gbps optical link in a FMC VITA 57.1 form factor for FPGA applications, for the high performance computing, rugged military, and industrial markets, to name a few. This demo is an optical interconnection between two FPGAs, with a Xilinx Development Card and two FMCs (FPGA mezzanine cards), one from TechWay and the other from Crossfield Technology. This is 8 lanes of 14 … [Read more...]
Optimize Bandwidth With The Signal Integrity Group and Teraspeed
You can’t talk about electronics without talking about the ever-increasing need for bandwidth. Samtec interconnect products are designed to optimize signal integrity by focusing on the connector footprint configuration, pin geometry, and plastics and dielectrics, to list just a few of many design considerations. But even the “fastest” connector, by itself, has limited bandwidth performance. Obviously addressing these increased bandwidth requirements necessitates a systems-level approach, … [Read more...]
Samtec to Present at Mentor Graphics Events
As a global leader in signal integrity, Samtec’s in-house engineering team utilizes EDA tools across the industry via our global 24/7 support of customer SI designs and applications. Our experience with these tools enables unique collaborations with EDA suppliers and industry leading technical events. Throughout spring and summer of 2016, we will be presenting our capabilities at technology events sponsored by Mentor Graphics. We invite you to stop by to learn more about … [Read more...]
There Are No Stupid Questions – Interconnect Test Report Frequently Asked Questions
Samtec provides a wide variety of test data for nearly every product we offer. Our goal is to provide thorough, straight-forward, easy-to-access data so you can choose the best product for your application. We field countless questions about interpreting data in test reports. I asked Mark Shireman from our Engineering Support Group to list five common questions we receive about our interconnect test reports. In addition, he provides a few tips and comments to help interpret … [Read more...]
Microwave Interconnect Testing For 12G SDI Applications
Samtec and Teraspeed Consulting presented several papers at DesignCon 2016. Samtec’s Jim Nadolny (Samtec’s Signal Integrity and EMI Engineer), Keysight Technology’s OJ Danzy (Application Engineer), and Imagine Communications' Boris Nevelev presented “Microwave Interconnect Testing For 12G SDI Applications.” SMPTE ST 2082-1:2015 is the current standard for high speed digital video and requires testing to 12 GHz for video connectors. Off the shelf test solutions exist for some types of … [Read more...]
FireFly Enhances High Performance Computing In The Data Center
In the world of high performance computing (HPC), the growing trend of hardware accelerations enables higher system performance. This is accomplished by offloading non-core processing functions and system I/O management to a secondary CPU or FPGA. While co-located HPC acceleration develops a growing acceptance in high-end servers, a number of systems leverage hardware acceleration via high speed serial busses like PCIe. In some systems, the PCIe-enabled hardware accelerators are found … [Read more...]
High Bandwidth Connector Design: Full Speed Ahead
You can’t talk about technology without mentioning the need for increased bandwidth and high bandwidth connector design. On the hardware side, many say we are facing the limits of what we can do with the tried-and-true technologies that have been the foundation for technology innovation thus far -- chips, laminates, boards and elements associated with them. Addressing increased bandwidth requirements requires a systems-level approach. Those systems are defined by the hardware elements … [Read more...]
Samtec: Not Just Connectors Anymore, Design Solutions From Silicon-to-Silicon
Our blog readers quickly realize that we at Samtec do not view ourselves as another connector company. We are extremely proud of our humble beginnings as we enter our 40th year of business. Our legacy in Flexible Stacking and Micro/Rugged components and cables forms the basis of who we are. Our customers depend on our Sudden Service® to minimize risk in prototype and production supply chains. Additionally, our Free Sample Programs support OEMs, ODMs, academia, makers and hobbyists … [Read more...]
VITA 42 XMC Keeps on Truckin’
Data. Data. Data. It seems like we can’t get enough. 28 Gbps, 56 Gbps, and 112 Gbps serial channel data rates are standard or roadmap options for semiconductor, connector and optical module manufacturers. It’s almost like you need a Bugatti Veyron or Lamborghini Murcielago to get to the drug store in under 3.0 seconds for some cold medicine. Unless you are some rich Italian playboy, you probably have a sedan, a SUV, or a regular pick-up truck to run your errands. Likewise, typical … [Read more...]
How Collaborative Engineering Enables Constant Innovation
Centerlines to 0.4 mm. Gold plating that is 5μ” thick. Contact systems rated at 30 Gbps. Connectors that can handle 10,000 cycles. While our expectations are high, we all know that developing the next generation interconnect solutions requires constant engineering and manufacturing innovation. And while connectors aren’t at the top of the electronics food chain, their role is critical in the successful functioning of any electronic system. The Samtec Advanced Interconnect Design Technology … [Read more...]
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