Check out the new Samtec Cable Group Tech Center video. It’s an overview of the Samtec Cable Group, our R&D and manufacturing Technology Center focusing on precision extruded micro coax and twinax cable used for high speed / high density cable assemblies, including 26-38 AWG, 50/75/85/100 ohm impedance, and systems rated at 28+ Gbps. Cable Options Samtec Cable Group offers a variety of center conductor, dielectric, shielding, and jacket options. Center conductor options include … [Read more...]
Samtec and Amphenol® Aerospace Partner to Address the Growing Need for Rugged Optics
Samtec and Amphenol® Aerospace recently announced a partnership to incorporate Samtec’s FireFly™ optical cable platform with Amphenol® Aerospace’s bulkhead interconnects for rugged optic solutions. Click here to read the official press release. FireFly™ Samtec’s FireFly™ is a mid-board cable and optical interconnect system. FireFly™ is incredibly dense, and it enables chip-to-chip, board-to-board, and system-to-board connectivity using the same connector system for both copper … [Read more...]
Impact Conference: Next Generation High Speed Data Transfer Rates
Scott McMorrow is speaking at the Impact Conference (Boards, Chips and Packaging: Designing To Maximize Benefits) on Tuesday, October 13th. He and a panel of experts are discussing Next Generation High Speed Data Transfer Rates. Quick Overview Of The Discussion The need for more bandwidth is continuing to drive the Internet infrastructure. Rapid growth of server, network and internet traffic is fueling the need for higher data rates. Key contributors to data demand … [Read more...]
Strike Up The Bandwidth Beyond 28 Gbps
Here is a link to an EDN article you need to read. Scott McMorrow, R&D Consultant for Teraspeed® Consulting (a division of Samtec), discusses the migration of high-speed data transfer rates to 28 Gbps and beyond. Here's a quick synopsis. We Can Barely Get To 56 Gbps With Today's Materials It’s hard to give an overview to such an insightful article, but I’ll try to give a quick recap: First, although many in the industry are successfully achieving information transfer rates … [Read more...]
Let’s Get Small … New Samtec Microelectronics Video
Check out the new Samtec Microelectronics Technology Center Video. It’s a an overview of our microelectronics and IC packaging capabilities, including precision die attach, ultra-fine pitch and low profile wire bond, flip chip, underfill, and dam and encapsulation, complete IC-to-board design, and support and manufacturing of IC packaging, substrates, micro high density interposers and micro optical engines. Samtec’s Technology Centers develop and advance technologies and products … [Read more...]
IEEE Working Group To Define High-Speed PCB Measurements
Have you ever received a measured Touchstone file from a vendor and felt the data was bad...or at least it had obvious passivity issues? Have you wanted to measure PCB traces and needed to de-embed the launch effects and found your data suspect? Maybe you wondered if you should trust the measured connector data above 20 GHz as the calibration traces were not the best? Getting high quality measured S-parameter data of embedded microwave structures is not a trivial effort, … [Read more...]
Dissimilar Metals And The Risk of Galvanic Corrosion in Mating Connectors
I am fascinated by the concept of dissimilar metals and galvanic corrosion. I stayed up until 3:45 am last night surfing the web to learn more. Of course I'm lying, but we do field questions about galvanic corrosion. Robbie Huffman, Samtec's Interconnect Processing Engineer, recently shared some information on this subject with our Field Sales Engineers. I hope you find it helpful: When choosing connectors for your application, it is important to choose mating connectors with similar … [Read more...]
How To Specify High-Speed Mezzanine Connectors
Julian Ferry, Samtec’s Principle R&D Engineer, recently explained to our friends at Connector Supplier how choosing a connector for mezzanine board-to-board applications presents challenges in several engineering disciplines. Signal integrity concerns make the selection even more complex. Check out Julian’s article here. Julian discusses a variety of topics, including physical requirements, mechanical performance, considerations for high-speed data parameters such as return loss, … [Read more...]
More On 25+ Gbps Backplane Design
I recently posted a blog about videos of Teraspeed®’s Scott McMorrow explaining how he determined the materials to choose in order to achieve the best performance for a backplane system with a 25 Gbps+ operation. Xilinx’s Xcell Daily Blog also reported on these videos, and they tell us more about the setup, including eval boards used (Xilinx VCU109) and the FPGA selected (Virtex UltraScale VU095), among other details. Check out the Xilinx blog here. I encourage you to check out Xcell … [Read more...]
At What Data Rate Do You Use Photons To Push Data?
Check out this silicon photonics article in EDN – “Silicon photonics: Will the hare finally catch the tortoise?” -- by Ransom Stephens. He asks Sylvie Menezo (Director of France’s IRT Nanoelectronics Silicon Photonics Program) at what data rate do you think engineers will have to focus on designs that use photons to push data? I think it’s a great discussion and article. FYI ... Ransom Stephens’ is a technologist, science writer, novelist, and Raiders fan Electronic Design … [Read more...]