Samtec's Istvan Novak has been named DesignCon Engineer of the Year. Congratulations, Istvan! Istvan is a Principle Signal and Power Integrity Engineer at Samtec, working on advanced signal and power integrity designs. He introduced the industry's first 25 um power-ground laminates for large rigid computer boards and worked with component vendors to create a series of low-inductance and controlled-ESR bypass capacitors. DesignCon 2020 Best Paper Award Samtec proudly … [Read more...]
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SC19 – Supercomputing Denver, CO
The International Conference for High Performance Computing, Networking, Storage, and Analysis Next-generation high-performance copper and optical interconnects must solve multiple technical challenges including higher data rates, increased system and chassis density and improved signal integrity. Samtec’s diverse product and technology portfolio provides system designers architectural solutions to the challenges faced by the industry. Several key solutions will be featured at … [Read more...]
AI, 5G and Automotive – Dispatches from XDF Silicon Valley
The FPGA (or ACAP) universe gathered at the San Jose Fairmount last week during the Xilinx Developer Forum. Engineers, data scientists, analysts, distributors, alliance partners and more came to learn about the latest hardware, software and system level solutions from Xilinx. Xilinx CEO Victor Peng set the theme of the event with his keynote. Xilinx (and thier partner's) business strategies revolve around three key growth drivers: Data Center, 5G and Automotive. The Samtec team … [Read more...]
Samtec to Demonstrate Next-Gen Architectures at AI Hardware Summit
"Artificial Intelligence" and "AI" are all the rage. From high frequency trading on Wall Street to improved drug development, AI affects more aspects of human lives daily. Many AI solutions harness the computing power of cloud connectivity, edge computing, data centers and HPC. There are any number of resources that discuss the best frameworks and learning algorithms. But what about the hardware? That is the goal of the AI Hardware Summit, being held September 17-18, 2019 at the Computer … [Read more...]
Connector, Cable Systems For AI Hardware Design
In this video, Samtec's Ralph Page walks us through a live demonstration of a prototypical AI (artificial intelligence) hardware design. It shows PCB connectors and twinax cable systems with performance capabilities suitable for AI hardware applications. It’s a configurable, next-generation, possibly GPU-based system that combines a cable mesh backplane, a rigid-style backplane, high-speed edge card connectors, and precision RF interconnects. For example, this design could be based on … [Read more...]
Samtec Showcases AI/ML Interconnect Demonstration at PCI-SIG Conference
The PCI-SIG Developers Conference is a free event for the 800+ member companies that develop and bring to market new products utilizing PCI Express® technology. Granted most people reading this blog won't be at the conference, but you might be interested in learning more about Samtec's demos and Technical Sessions. Demonstrations Scalable 32 GT/s Silicon Test Platform: This is a demonstration of configurable, next-generation GPU-based system combining a cable mesh … [Read more...]