Advanced Technologies Augment Samtec Technology Roadmap for 3-D Packaging, Sensor Modules, and Wireless Connectivity New Albany, IN, May 31, 2016 – Samtec, Inc., a leading provider of high bandwidth and micro-pitch interconnect systems, announced today the acquisition of nMode Solutions, of Oro Valley, Arizona. “The acquisitions of nMode Solutions and their subsidiary, Triton Microtechnologies, is a critical next step in Samtec’s technology roadmap. This furthers our … [Read more...]
Samtec Expands Optical Product Portfolio
Readers of the Samtec blog know how excited we get talking about our FireFly™ Micro Flyover System™ and the optical engine technology included in FireFly. Sometimes we forget to talk about our other optical products. In recent weeks, Samtec has added to our repertoire of optical product offerings via some product line extensions and new releases. These include the following three product families: PCIEO-4G3, FOPC and OPA. PCIEO-4G3 Option for Active Optical Cable … [Read more...]
High Speed, High Density Right Angle Socket Array Saves 50 Percent Board Space
Samtec’s new high speed, high density right angle socket array - SEARAY™ 0.80 mm pitch - is ideal for perpendicular board-to-board and micro backplane applications with up to 50 percent board space savings compared to .050" (1.27 mm) pitch SEARAY™ interconnects. The open pin field design allows for maximum grounding and routing flexibility with up to 500 total Edge Rate® contacts. This ultra high density right angle socket array (SEAF8-RA Series) features: a choice of 8 or 10 … [Read more...]
Samtec and Amphenol® Aerospace Partner to Address the Growing Need for Rugged Optics
Samtec and Amphenol® Aerospace recently announced a partnership to incorporate Samtec’s FireFly™ optical cable platform with Amphenol® Aerospace’s bulkhead interconnects for rugged optic solutions. Click here to read the official press release. FireFly™ Samtec’s FireFly™ is a mid-board cable and optical interconnect system. FireFly™ is incredibly dense, and it enables chip-to-chip, board-to-board, and system-to-board connectivity using the same connector system for both copper … [Read more...]
Dense, Rugged, and Fast: This Is A Cable Assembly, Not Your Daughter’s Boyfriend
Samtec’s new SEARAY™ 0.80 mm pitch ultra-high density array cable assemblies provide 50% board space savings compared to 1.27 mm pitch systems. With performance to 15 Gbps and up to 300 total Edge Rate® contacts, this cable system is designed for rugged high speed applications where space is limited. High Speed Cable Assembly SEARAY™ 0.80 mm pitch array cable assembly -- the ESCA Series -- offers 50Ω single ended signal routing on 34 AWG micro ribbon coax cable, and it supports PCIe® … [Read more...]
New SEARAY™ High Density Press Fit Right Angle Socket
Samtec’s SEARAY™ high density, high-speed array interconnect is now available in a right angle, press-fit design. SEARAY™ The SEARAY™ high speed array system is a 1.27 mm pitch open pin field array for maximum grounding and routing flexibility. It is available with up to 500 I/Os, and the rugged Edge Rate® contact has low insertion and withdrawal forces to simplify pcb handling. SEARAY® is an Extended Life Product™ (ELP) and has passed 10 year mixed flowing gas (MFG) and high … [Read more...]
PCIe® Gen 3 Protocol Over Fiber
Samtec PCIEO Series Active Optical Cable Assemblies use a patented optical engine technology allowing low power consumption while significantly extending the PCIe® bus. These Active Optical Cable Assemblies allow new and existing PCIe® Expansion and Extension systems to extend the distance between ports up to 100 meters at Gen 3 data rates. The cable length can be easily customized with either a 100 MHz clock or with no clock. These Active Optical Cables are plug-compatible, … [Read more...]
Direct Connect High Speed Press Fit Cable Assembly
Our new DCC Series -- direct connect cable system – is a cost-effective high speed cable solution that supports and surpasses PCIe® Gen3 speeds at 2 meters cable length. The DCC is rugged. High retention press fit pins attach directly to the PCB, eliminating the cost of the mating connector. Fortunately an extraction tool is available. The assembly also has an over-molded strain relief. The connector saves space. First, it is low profile, only 3,00 mm tall. Second, it also saves space … [Read more...]
Samtec Announces Hirose as Second Source for FireFly™ Micro Flyover System™
Samtec, Inc. is pleased to announce an agreement with Hirose Electric USA, Inc. as a second source for Samtec’s FireFly™ Micro Flyover System™. As a certified independent second source, Hirose can now provide its customers a future-proof inside-the-box system, as well as additional support to Samtec’s customers who use FireFly™ for current and future applications. Adam Linderman, SI Product Manager for Samtec said, “Having a dual source for FireFly™ further demonstrates Samtec’s dedication to … [Read more...]
60A Power Socket Now Available With Press Fit Termination
Samtec’s line of PowerStrip™ interconnects includes the EXTreme Ten60Power™ socket and terminal system that delivers high current power performance of up to 60A per power blade (1 blade powered at 75ºC; 30ºC Temperature Rise). These interconnects are available as power only or signal/power combinations for increased design flexibility. Symmetrical or asymmetrical configurations of up to 12 total power blades on 5,50 mm (.217") pitch are available on either side of 24 signal pins on 2,54 mm … [Read more...]