Samtec's ultra high density open pin field arrays, created on an 0,80 mm pitch can save you up to 50% board space compared to standard 1,27 mm pitch grid arrays. High density socket arrays, our SEAF8 Series, and terminal arrays, our SEAM8 Series, come standard with patented rugged Edge Rate™ contacts, which are less prone to damage when “zippered” to unmate. SEARAY™ .8 is currently available up to 300 I/Os Two new options include an 8 row and a 10 row design which allow up to 500 I/Os. … [Read more...]
Micro Array Interposers For High Density, Low Profile Board-to-Board and IC-to-Board Applications
Samtec Z-Ray™ is an array of embedded contacts used as interposers for board stacking, IC-to-board, and cable-to-board applications. These micro array interposers are ultra-high density, low profile, highly customizable solutions for complex IC-to-board applications. Z-Ray™ incorporates spring temper BeCu (Beryllium Copper) micro-formed contacts that are assembled into rugged low profile FR4 substrates under high pressure and temperature. Z-Ray™ is tested to 2,500 cycles and is available … [Read more...]
Samtec Releases 2,00 mm Pitch Discrete Wire IDC With Latching Option
Samtec recently released a 2,00 mm pitch discrete wire IDC system designed for a high reliability connection and ease of discrete wire termination in field applications. Available as IDC components only, this system eliminates the expense and need for special tooling, as well as any additional cost to purchase and inventory separate parts including bodies, contacts, etc. Check out the video demonstration of the wire termination with standard flat jaw pliers. The discrete wire IDC … [Read more...]
Micro Flyover Cable System Allows Future-Proof Designs
Samtec's FireFly™ Micro Flyover System is an inside-the-box interconnect system that gives designers the option to future-proof their systems. This future proofing allows an easy upgrade from copper to optical with the same connector and footprint. With the highest 14 Gbps bandwidth density available, the FireFly™ system enables chip-to-chip, board-to-board and system-to-system connectivity at data rates up to 28Gb/s (in development). By taking the data connections “off-board” with flyover … [Read more...]
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