Samtec, a privately held $625 million global manufacturer of a broad line of electronic interconnect solutions, has expanded its family of Z-Ray® micro pitch interposers to include an ultra-low-profile cable system for high-speed cable-to-board applications where space is limited. The 0.80 mm pitch system, with an overall height of less than 4 mm, features a […]
Amphenol and Samtec Sign License Agreement for Backplane Interconnect Products
Licensing agreement brings electronics equipment manufacturers a reliable new supplier of Amphenol’s high performance backplane connectors Nashua, NH, May, 2016 — Amphenol, the leading provider of high performance backplane interconnect systems, and Samtec, Inc., a leader in interconnect systems and signal integrity consulting, have entered into license agreements for several backplane connector families. Under the […]
Samtec Announces Acquisition Of nMode Solutions and Triton Microtechnologies
Advanced Technologies Augment Samtec Technology Roadmap for 3-D Packaging, Sensor Modules, and Wireless Connectivity New Albany, IN, May 31, 2016 – Samtec, Inc., a leading provider of high bandwidth and micro-pitch interconnect systems, announced today the acquisition of nMode Solutions, of Oro Valley, Arizona. “The acquisitions of nMode Solutions and their subsidiary, Triton Microtechnologies, is […]
Samtec Expands Optical Product Portfolio
Readers of the Samtec blog know how excited we get talking about our FireFly™ Micro Flyover System™ and the optical engine technology included in FireFly. Sometimes we forget to talk about our other optical products. In recent weeks, Samtec has added to our repertoire of optical product offerings via some product line extensions and new […]
High Speed, High Density Right Angle Socket Array Saves 50 Percent Board Space
Samtec’s new high speed, high density right angle socket array – SEARAY™ 0.80 mm pitch – is ideal for perpendicular board-to-board and micro backplane applications with up to 50 percent board space savings compared to .050″ (1.27 mm) pitch SEARAY™ interconnects. The open pin field design allows for maximum grounding and routing flexibility with up to 500 […]
Samtec and Amphenol® Aerospace Partner to Address the Growing Need for Rugged Optics
Samtec and Amphenol® Aerospace recently announced a partnership to incorporate Samtec’s FireFly™ optical cable platform with Amphenol® Aerospace’s bulkhead interconnects for rugged optic solutions. Click here to read the official press release. FireFly™ Samtec’s FireFly™ is a mid-board cable and optical interconnect system. FireFly™ is incredibly dense, and it enables chip-to-chip, board-to-board, and system-to-board connectivity using the […]
Dense, Rugged, and Fast: This Is A Cable Assembly, Not Your Daughter’s Boyfriend
Samtec’s new SEARAY™ 0.80 mm pitch ultra-high density array cable assemblies provide 50% board space savings compared to 1.27 mm pitch systems. With performance to 15 Gbps and up to 300 total Edge Rate® contacts, this cable system is designed for rugged high speed applications where space is limited. High Speed Cable Assembly SEARAY™ 0.80 […]
New SEARAY™ High Density Press Fit Right Angle Socket
Samtec’s SEARAY™ high density, high-speed array interconnect is now available in a right angle, press-fit design. SEARAY™ The SEARAY™ high speed array system is a 1.27 mm pitch open pin field array for maximum grounding and routing flexibility. It is available with up to 500 I/Os, and the rugged Edge Rate® contact has low insertion […]
PCIe® Gen 3 Protocol Over Fiber
Samtec PCIEO Series Active Optical Cable Assemblies use a patented optical engine technology allowing low power consumption while significantly extending the PCIe® bus. These Active Optical Cable Assemblies allow new and existing PCIe® Expansion and Extension systems to extend the distance between ports up to 100 meters at Gen 3 data rates. The cable length […]
New 1.00 mm Pitch Ultra Low Profile, Ultra High Density Interposer
Samtec’s Z-Ray® one piece arrays are ultra-low profile, high density and highly customizable. These compression contact arrays are used as interposers or as board level interconnects. Compared to standard interposers, they feature greater density, X-Y-Z axes flexibility, customizable shapes and patterns, increased cycle life, low normal force with high deflection range and 28+ Gbps performance. […]