PCIe 4.0 is just around the corner in 2017, at least according to the leading computer processor vendors. In recent months, both Intel and AMD have hinted at plans for PCIe 4.0 in future platforms. This promotes the advantages of the new standard with hopes of a wider range of applications. Here is a quick review of some of PCIe 4.0 advantages: Double the bandwidth over PCIe 3.0 from 8 GTps to 16 GTpsEnhanced power efficiencyFull backwards compatibility with previous … [Read more...]
Samtec Expands ExaMAX® High-Speed Backplane Connector System
Samtec proudly announces the expansion of the ExaMAX® High-Speed Backplane Connector System optimized for high-density and high-speed performance. The scalable ExaMAX® system meets today’s data rates while providing a future-proof path for next generation architectures. The ExaMAX® header and right-angle receptacle system (EBTM/EBTF-RA Series) is optimized for speeds up to 28 Gbps on a 2.00 mm column pitch or 56 Gbps on a 3.00 mm column pitch. For 28 Gbps performance, this system meets and … [Read more...]
Samtec Releases Ultra-Low-Profile, 28 Gbps Micro Pitch Cable System
Samtec, a privately held $625 million global manufacturer of a broad line of electronic interconnect solutions, has expanded its family of Z-Ray® micro pitch interposers to include an ultra-low-profile cable system for high-speed cable-to-board applications where space is limited. The 0.80 mm pitch system, with an overall height of less than 4 mm, features a mating compression mount interposer and a rugged metal cage. The Z-Ray® ultra-low-profile cable assembly (ZRDP Series) features 34 AWG … [Read more...]
Amphenol and Samtec Sign License Agreement for Backplane Interconnect Products
Licensing agreement brings electronics equipment manufacturers a reliable new supplier of Amphenol’s high performance backplane connectors Nashua, NH, May, 2016 -- Amphenol, the leading provider of high performance backplane interconnect systems, and Samtec, Inc., a leader in interconnect systems and signal integrity consulting, have entered into license agreements for several backplane connector families. Under the agreements, Amphenol will license its intellectual property and detailed … [Read more...]
Samtec Announces Acquisition Of nMode Solutions and Triton Microtechnologies
Advanced Technologies Augment Samtec Technology Roadmap for 3-D Packaging, Sensor Modules, and Wireless Connectivity New Albany, IN, May 31, 2016 – Samtec, Inc., a leading provider of high bandwidth and micro-pitch interconnect systems, announced today the acquisition of nMode Solutions, of Oro Valley, Arizona. “The acquisitions of nMode Solutions and their subsidiary, Triton Microtechnologies, is a critical next step in Samtec’s technology roadmap. This furthers our … [Read more...]
Samtec Expands Optical Product Portfolio
Readers of the Samtec blog know how excited we get talking about our FireFly™ Micro Flyover System™ and the optical engine technology included in FireFly. Sometimes we forget to talk about our other optical products. In recent weeks, Samtec has added to our repertoire of optical product offerings via some product line extensions and new releases. These include the following three product families: PCIEO-4G3, FOPC and OPA. PCIEO-4G3 Option for Active Optical Cable … [Read more...]
High Speed, High Density Right Angle Socket Array Saves 50 Percent Board Space
Samtec’s new high speed, high density right angle socket array - SEARAY™ 0.80 mm pitch - is ideal for perpendicular board-to-board and micro backplane applications with up to 50 percent board space savings compared to .050" (1.27 mm) pitch SEARAY™ interconnects. The open pin field design allows for maximum grounding and routing flexibility with up to 500 total Edge Rate® contacts. This ultra high density right angle socket array (SEAF8-RA Series) features: a choice of 8 or 10 … [Read more...]
Samtec and Amphenol® Aerospace Partner to Address the Growing Need for Rugged Optics
Samtec and Amphenol® Aerospace recently announced a partnership to incorporate Samtec’s FireFly™ optical cable platform with Amphenol® Aerospace’s bulkhead interconnects for rugged optic solutions. Click here to read the official press release. FireFly™ Samtec’s FireFly™ is a mid-board cable and optical interconnect system. FireFly™ is incredibly dense, and it enables chip-to-chip, board-to-board, and system-to-board connectivity using the same connector system for both copper … [Read more...]
Dense, Rugged, and Fast: This Is A Cable Assembly, Not Your Daughter’s Boyfriend
Samtec’s new SEARAY™ 0.80 mm pitch ultra-high density array cable assemblies provide 50% board space savings compared to 1.27 mm pitch systems. With performance to 15 Gbps and up to 300 total Edge Rate® contacts, this cable system is designed for rugged high speed applications where space is limited. High Speed Cable Assembly SEARAY™ 0.80 mm pitch array cable assembly -- the ESCA Series -- offers 50Ω single ended signal routing on 34 AWG micro ribbon coax cable, and it supports PCIe® … [Read more...]
New SEARAY™ High Density Press Fit Right Angle Socket
Samtec’s SEARAY™ high density, high-speed array interconnect is now available in a right angle, press-fit design. SEARAY™ The SEARAY™ high speed array system is a 1.27 mm pitch open pin field array for maximum grounding and routing flexibility. It is available with up to 500 I/Os, and the rugged Edge Rate® contact has low insertion and withdrawal forces to simplify pcb handling. SEARAY® is an Extended Life Product™ (ELP) and has passed 10 year mixed flowing gas (MFG) and high … [Read more...]
