Check out our new SEARAY™ video for a quick overview of why it’s one of the fastest-growing, most robust interconnect systems in the industry. Here’s why: high density (up to 500 I/Os)high speed (28+ Gbps)routing and grounding flexibility (open pin field design for differential pairs, single ended designs, and power)Differential Vias™ PCB routing for high density, DP applicationslow profile (down to 4mm stack)ultra-high density space saving designs (0.80 mm pitch saves 50% board space vs. … [Read more...]
SEARAY™ Solder Joints Are Class 3, IPC-A-610
Samtec SEARAY™ SEAM, SEAF Series solder joints are now classified as Class 3 in the IPC-A-610 Rev F Standard. Class 3 is for high performance/harsh environment electronic products. This includes products where continual high performance or performance-on-demand is critical, equipment downtime cannot be tolerated, the end-use environment may be extremely harsh, and the equipment must function when required. Common examples include flight controls on an aircraft and life support or other critical … [Read more...]
Samtec Joins IRT Nanoelec Silicon Photonics Program
Samtec is pleased to announce its entrance in the Silicon Photonics Program of the IRT Nanoelec headed by CEA-Leti. Samtec is joining CNRS, STMicroelectronics, Mentor Graphics and CEA-Leti to develop and industrialize optical communications solutions using Silicon Photonics technology for addressing Data Centers and High Performance Computing applications. Officials from all parties expressed their enthusiasm. “We are thrilled with the opportunity to join the Silicon Photonics Program of the … [Read more...]
Samtec 12 Channel, 28G FireFly Demo – An Interview With Kevin Burt
Check out this video from OFC, with Samtec's Kevin Burt discussing the demo of our FireFly™ 12 channel optical Micro Flyover™ System operating at 28 Gbps/channel (336 Gbps aggregate). Kevin also discusses the benefits of mid-board optics. … [Read more...]
28 Gbps FireFly Demo With Anritsu MP1800A At OFC
Anritsu Company (OFC booth #1309) and Samtec (OFC booth #1849) are conducting optical transmission technology demonstrations in the Samtec booth during OFC 2015, in Los Angeles, March 24-26. The demonstrations use high quality signals generated from the Anritsu MP1800A BERT Signal Quality Analyzer to highlight the link performance (up to 28 Gbps) of Samtec’s new 12 channel, 28 Gbps FireFly™ Micro Flyover System™. The superior signal integrity up to 32 Gbps of the MP1800A BERT enables Samtec … [Read more...]
Be Sure to Visit Samtec at OFC
We hope you can visit us at OFC, March 24-26, at the Los Angeles Convention Center. Our booth (#1849) will have two high-speed product demonstrations and onsite experts to bring you up-to-speed about several new Samtec products. Our physical product demonstrations include a FireFly™ 12 channel optical Micro Flyover™ System operating at 28 Gbps/channel (336 Gbps aggregate), and Samtec ExaMAX® backplane systems at 28 Gbps/channel (1 Tbps/connector pair) and 40 Gbps/channel (1.25 Tbps/connector … [Read more...]
Samtec Announces Hirose as Second Source for FireFly™ Micro Flyover System™
Samtec, Inc. is pleased to announce an agreement with Hirose Electric USA, Inc. as a second source for Samtec’s FireFly™ Micro Flyover System™. As a certified independent second source, Hirose can now provide its customers a future-proof inside-the-box system, as well as additional support to Samtec’s customers who use FireFly™ for current and future applications. Adam Linderman, SI Product Manager for Samtec said, “Having a dual source for FireFly™ further demonstrates Samtec’s dedication to … [Read more...]
Another DesignCon 2015 Paper – Causality Demystified (Best Paper Award Finalist)
Samtec and Teraspeed Consulting presented several papers at DesignCon 2015. One paper, "Causality Demystified," was a DesignCon 2015 Best Paper Award Finalist. Download the Causality Demystified paper from DesignCon 2015 Here's a summary if you prefer to check it out first: The quality of time domain simulation results depends on the quality of the Sparameter models used. Causality is shown to be an important parameter limiting the usefulness of a model. In this paper we demonstrate … [Read more...]
DesignCon 2015 Paper Now Available – “Optimizing Symmetry In Open Pin Field Designs
Samtec and Teraspeed Consulting presented several papers at DesignCon 2015. The first is "Optimizing Symmetry In Open Pin Field Designs." This paper presents a process for analyzing open field array structures. Various modes of propagation and coupling within the array of conductors are studied. We find that, counter intuitively, the use of additional ground structures can be detrimental to performance. It is demonstrated that by careful use of symmetry, high signal density can be achieved … [Read more...]
DesignCon 2015 Paper – Anisotropic Design Considerations For 28 Gbps Via to Stripline Transitions
Teraspeed Consulting and Samtec presented several papers at DesignCon 2015. Here's a link to "Anisotropic Design Considerations For 28 Gbps Via to Stripline Transitions." For 28-56 Gb/s design the homogeneous isotropic material assumption is a key impediment in model to measurement correlation. Without accurate dielectric material models, it is impossible to close the loop between electromagnetic modeling and actual operation. Epoxy/glass PCB materials present a layered-anisotropic dielectric … [Read more...]