Samtec recently expanded its line of Tiger Eye™ products with a 0,80 mm pitch discrete wire system ideal for rugged applications where a highly reliable connection must be maintained. The micro pitch system increases contact density for greater space savings and features Samtec’s Tiger Eye™ contacts, which are designed for high reliability and high mating cycles. The Tiger Eye™ discrete wire socket cable assembly (SESDT Series) is available in a double row design with up to 40 total positions … [Read more...]
New Panel Mount Discrete Wire Cable Assembly
Samtec recently released a new panel mount discrete wire cable assembly as part of its Mini Mate® product family. This new panel mount discrete wire assembly is ideal for in-line connections required to pass through a panel. The assembly accommodates a panel thickness of .0329" (0,84 mm) to .0897” (2,28 mm). This .100" (2,54 mm) pitch Mini Mate® panel mount assembly (MRTD/MRTDT Series) is a double row terminal cable with up to 30 total positions and a choice of 20 to 30 AWG discrete wire in … [Read more...]
Samtec, FCI Sign Second Source Pact For ExaMAX
Samtec and FCI announced the signing of a second-source agreement for Samtec to manufacture, market and sell FCI’s ExaMAX® high speed backplane system. We will keep you posted as more details become available. View The Full Press Release PDF Click here for a product overview: http://samtec.com/examax … [Read more...]
Julian Ferry Interview On High Speed Interconnect Design Developments
Julian Ferry, Samtec’s High Speed R&D Manager, recently spoke to Connector Supplier about the latest developments in high speed interconnects, the applications driving them, and how Samtec is meeting the challenges. Here is a full copy of the interview, courtesy of Connector Supplier. Q&A: Samtec on Signal Integrity. By Patricia Staino, June 16, 2014 Recently we spoke to Julian Ferry, high-speed R&D manager at Samtec, to learn more about the latest developments in high-speed … [Read more...]
Sealed, High Density IP67 Mini Push-Pull System
Samtec's new AccliMate™ Sealed Mini Push-Pull system is IP67 protected against dust and water, making it ideal for harsh environments and high density applications. The system is constructed of lightweight plastic and designed with a small round form factor for increased density on the panel. These are available as the MCP-8 and MCR-8 Series This sealed cable system is intermateable with the Hirose HR30 Series, allowing for ease of integration into existing systems. The cable-to-cable … [Read more...]
High Density SEARAY™ .8 Saves 50% Board Space
Samtec's ultra high density open pin field arrays, created on an 0,80 mm pitch can save you up to 50% board space compared to standard 1,27 mm pitch grid arrays. High density socket arrays, our SEAF8 Series, and terminal arrays, our SEAM8 Series, come standard with patented rugged Edge Rate™ contacts, which are less prone to damage when “zippered” to unmate. SEARAY™ .8 is currently available up to 300 I/Os Two new options include an 8 row and a 10 row design which allow up to 500 I/Os. … [Read more...]
Samtec Releases 2,00 mm Pitch Discrete Wire IDC With Latching Option
Samtec recently released a 2,00 mm pitch discrete wire IDC system designed for a high reliability connection and ease of discrete wire termination in field applications. Available as IDC components only, this system eliminates the expense and need for special tooling, as well as any additional cost to purchase and inventory separate parts including bodies, contacts, etc. Check out the video demonstration of the wire termination with standard flat jaw pliers. The discrete wire IDC … [Read more...]
Micro Flyover Cable System Allows Future-Proof Designs
Samtec's FireFly™ Micro Flyover System is an inside-the-box interconnect system that gives designers the option to future-proof their systems. This future proofing allows an easy upgrade from copper to optical with the same connector and footprint. With the highest 14 Gbps bandwidth density available, the FireFly™ system enables chip-to-chip, board-to-board and system-to-system connectivity at data rates up to 28Gb/s (in development). By taking the data connections “off-board” with flyover … [Read more...]
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