“Where high frequency meets high speed,” says the tag line of past EDI CON USA events. What exactly is EDI CON?
Technical specialists from across the RF, microwave, EMC/EMI, high-speed digital design and system integrator spectrum met annually. Why? For networking, training and learning opportunities naturally.
What about 2019? In a new twist, this event is going digital. EDI CON ONLINE replaces the in person events with virtual, real-time training. It has been specifically targeted for engineers’ desktops and mobile devices.
Samtec Delivers SI/PI Track Keynote at EDI CON on 112 Gbps PAM4 Interconnect
As data rate requirements approach and surpass 56/112 Gbps PAM4, developers are challenged with balancing increasing throughput, scalability and density demands with concerns such as power consumption, signal integrity, cost and time-to-market.
The keynote is entitled 56/112 Gbps From the Front Panel to the Backplane. It will be presented by Jignesh Shah, Samtec Sr. System Architect, and Kevin Burt, Director of Application Engineering.
Jignesh, Kevin and others will demonstrate real-world applications in high-performance interconnect design, channel optimization, and alternate system architectures that exceed the demands of next generation data transmission.
Scott McMorrow Expounds on 112 Gbps PAM4 Design
One of Samtec’s key SI/PI technical experts is Scott McMorrow. He currently serves as CTO for Samtec’s Signal Integrity Group.
As a consultant for years too numerous to mention, Scott has helped many companies develop high performance products, while training signal integrity engineers. Today he works for “the man,” where he continues being a problem solver, a change agent and “betting his job” every day.
Prototype 112 Gbps PAM4 silicon is already available. Production 112 Gbps PAM4 silicon is just around the corner. Routing 112 Gbps PAM4 signals through a system poses many challenges for designers.
In this course, Scott will detail an interconnect design process from concept and design through simulation, testing and correlation to high-volume manufacturing. He will explore how the correlation between simulated and tested and measured results builds confidence in a design process.
Register here for Scott McMorrow’s presentation.
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