Embedded computing differs from general computing in one key way. Embedded computing solutions are typically tasked with a specific or dedicated function. An example may be monitoring environmental variables like humidity, temperature, barometric pressure and more in a factory.
Embedded computing platforms like SoMs and CoMs constantly add functionality and capability. As a result, the difference between embedded and general computing may be blurred. It’s a constant challenge to keep up with the new advances in embedded solutions.
One event, the Embedded Tech Trends (ETT) forum, aims for unblurring those likes. The 2024 event is coming up on January 22-23 at the Embassy Suites Hotel in Ft. Lauderdale. Samtec will be sponsoring ETT again in 2024.
What is Embedded Tech Trends?
Embedded Tech Trends is an industry-wide forum. Leaders from the embedded media, C-suite and technology suppliers convene annually to share ideas on the latest embedded development technologies, trends, and products.
ETT is an excellent opportunity for the media covering the critical and intelligent embedded computing industry and suppliers to get together and discuss technology advancements, design wins, and products. Its a must-attend event for anyone developing boards, systems, and software for critical and intelligent embedded computing.
Open Interface System-on-Modules
Samtec offers the industry’s largest variety of board-to-board connectors. Popular options include high-speed mezzanine, ultra micro, edge card, backplane systems and high-density array systems. Mezzniane connectors form the key interconnect between embedded SoMs and carrier cards.
Several SoMs interfaces adopt open standard solutions. A good example it PICMG® COM-HPC®. This open standard exceeds the demand for high-speed performance in embedded computers. COM-HPC coexists with the COM Express® specification, but provides the scalability and enhanced performance for next-gen embedded system design.
The new standard supports two different module types. COM-HPC server modules enable the intelligent edge. COM-HPC client modules support robust embedded computing. The new COM-HPC Mini Modules target smaller, denser embedded solutions. COM-HPC provides access to more system memory (up to 1 TB RAM) and system flexibility for GPGPUs, FPGAs and DSPs.
At ETT, Samtec technical experts will present the topic The Latest Trends in Open Standards SoM Interfaces. The presentation will also include a roadmap of Samtec’s board-to-board interconnect portfolio.
More Information
Please visit www.embeddedtechtrends.com for more information about this year’s event. A detailed list of sponsors, attendees, and themes is available.
Please visit www.samtec.com/standards or email [email protected] for more information on all of the Samtec’s Standards-based activities.
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