OCP Europe and SamtecOCP Europe is quickly becoming a leading technology event for the data center industry. As a leader in high-speed connectivity, Samtec will demonstrate multiple Silicon-to-Silicon system optimization architectures. Samtec application engineers and signal integrity experts will be on to provide details on these new system-level solutions. Two demonstrations will be front-and-center at our booth (booth #A23). The first is a fully-functional 12.8 Terabit OCP wedge switch re-architected with Samtec Flyover™ QSFP-DD. Second is a thermal demonstration of a modular architecture switch with 32 QSFP-DDs at 14 watts each, and a 12.8 Terabit ASIC up to 500 watts. Jignesh Shah, Senior Technologist of High Speed Connectivity at Samtec, will present “Modular Architecture – Empowered By Flyover Twin-ax,” on Tuesday, 2 October, from 14:00 – 14:30. Click here to learn more about this presentation. Other demonstrations at the Samtec booth (#A23) include:
- 112 Gbps PAM4 Credo + Samtec AcceleRate® to QSFP-DD System: This demonstration shows Samtec’s Flyover technology which allows a cost-effective, high-performance answer to the challenges of 112 Gbps bandwidth.
- 28 Gbps Product Demonstrator: This is a small version of a real system which uses active retiming devices at 28 Gbps, for short reach and medium reach channels, and it incorporates most of Samtec’s 28 Gbps products. The demonstrator concurrently generates 80 PRBS31 signals at 28 Gbps. Each signal passes through one or more Samtec connectors, and we measure bit errors, signal amplitude, and eye patterns, all in real-time.